IC,SERIAL EEPROM,1KX8,CMOS,SOP,8PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | STMicroelectronics |
Reach Compliance Code | not_compliant |
Data retention time - minimum | 10 |
Durability | 100000 Write/Erase Cycles |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e0 |
memory density | 8192 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of terminals | 8 |
word count | 1024 words |
character code | 1000 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 1KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP8,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | SERIAL |
power supply | 5 V |
Certification status | Not Qualified |
Serial bus type | SPI |
Maximum standby current | 0.00005 A |
Maximum slew rate | 0.002 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
write protect | HARDWARE/SOFTWARE |
ST95080M6 | ST95080B6 | ST95080B3 | ST95080M6TR | ST95080M3TR | ST95080B1 | ST95080M1 | ST95080M3 | ST95080M1TR | |
---|---|---|---|---|---|---|---|---|---|
Description | IC,SERIAL EEPROM,1KX8,CMOS,SOP,8PIN,PLASTIC | 1KX8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 | 1KX8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 | 1KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 1KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 1KX8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 | IC,SERIAL EEPROM,1KX8,CMOS,SOP,8PIN,PLASTIC | IC,SERIAL EEPROM,1KX8,CMOS,SOP,8PIN,PLASTIC | 1KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | unknown | unknown | not_compliant | not_compliant | not_compliant | unknow |
Data retention time - minimum | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
JESD-30 code | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
memory density | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bi |
Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
word count | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
character code | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
Maximum operating temperature | 85 °C | 85 °C | 125 °C | 85 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | - | -40 °C | - |
organize | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | DIP | DIP | SOP | SOP | DIP | SOP | SOP | SOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Serial bus type | SPI | SPI | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | NO | YES | YES | NO | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | COMMERCIAL | COMMERCIAL | AUTOMOTIVE | COMMERCIAL |
Terminal form | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Is it Rohs certified? | incompatible | incompatible | incompatible | - | - | incompatible | incompatible | incompatible | - |
Maker | STMicroelectronics | - | - | - | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
Durability | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | - | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | - |
JESD-609 code | e0 | e0 | e0 | - | - | e0 | e0 | e0 | - |
Encapsulate equivalent code | SOP8,.25 | DIP8,.3 | DIP8,.3 | - | - | DIP8,.3 | SOP8,.25 | SOP8,.25 | - |
power supply | 5 V | 5 V | 5 V | - | - | 5 V | 5 V | 5 V | - |
Maximum standby current | 0.00005 A | 0.00005 A | 0.00005 A | - | - | 0.00005 A | 0.00005 A | 0.00005 A | - |
Maximum slew rate | 0.002 mA | 0.002 mA | 0.002 mA | - | - | 0.002 mA | 0.002 mA | 0.002 mA | - |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
write protect | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - |
Parts packaging code | - | DIP | DIP | SOIC | SOIC | DIP | - | - | SOIC |
package instruction | - | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, | SOP, | DIP, DIP8,.3 | - | - | SOP, |
Contacts | - | 8 | 8 | 8 | 8 | 8 | - | - | 8 |
ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | EAR99 |
Other features | - | 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE | 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE | 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE | 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE | 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE | - | - | 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE |
Maximum clock frequency (fCLK) | - | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | - | - | 2 MHz |
length | - | 9.55 mm | 9.55 mm | 4.9 mm | 4.9 mm | 9.55 mm | - | - | 4.9 mm |
Number of functions | - | 1 | 1 | 1 | 1 | 1 | - | - | 1 |
Operating mode | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | - | SYNCHRONOUS |
Maximum seat height | - | 5.9 mm | 5.9 mm | 1.75 mm | 1.75 mm | 5.9 mm | - | - | 1.75 mm |
Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - | 5.5 V |
Minimum supply voltage (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - | 4.5 V |
width | - | 7.62 mm | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm | - | - | 3.9 mm |
Maximum write cycle time (tWC) | - | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | - | - | 10 ms |