EEWORLDEEWORLDEEWORLD

Part Number

Search

THLY25N01B75

Description
IC 32M X 64 SYNCHRONOUS DRAM MODULE, 5.4 ns, DMA144, SODIMM-144, Dynamic RAM
Categorystorage    storage   
File Size725KB,13 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric Compare View All

THLY25N01B75 Overview

IC 32M X 64 SYNCHRONOUS DRAM MODULE, 5.4 ns, DMA144, SODIMM-144, Dynamic RAM

THLY25N01B75 Parametric

Parameter NameAttribute value
Parts packaging codeMODULE
package instructionDIMM, DIMM144,32
Contacts144
Reach Compliance Codeunknown
ECCN codeEAR99
access modeDUAL BANK PAGE BURST
Maximum access time5.4 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)133 MHz
I/O typeCOMMON
JESD-30 codeR-XDMA-N144
memory density2147483648 bit
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals144
word count33554432 words
character code32000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32MX64
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM144,32
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply3.3 V
Certification statusNot Qualified
refresh cycle8192
self refreshYES
Maximum standby current0.008 A
Maximum slew rate1.28 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch0.8 mm
Terminal locationDUAL
Base Number Matches1

THLY25N01B75 Related Products

THLY25N01B75 THLY25N01B70
Description IC 32M X 64 SYNCHRONOUS DRAM MODULE, 5.4 ns, DMA144, SODIMM-144, Dynamic RAM IC 32M X 64 SYNCHRONOUS DRAM MODULE, 5.4 ns, DMA144, SODIMM-144, Dynamic RAM
Parts packaging code MODULE MODULE
package instruction DIMM, DIMM144,32 DIMM, DIMM144,32
Contacts 144 144
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
access mode DUAL BANK PAGE BURST DUAL BANK PAGE BURST
Maximum access time 5.4 ns 5.4 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH
Maximum clock frequency (fCLK) 133 MHz 143 MHz
I/O type COMMON COMMON
JESD-30 code R-XDMA-N144 R-XDMA-N144
memory density 2147483648 bit 2147483648 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
memory width 64 64
Number of functions 1 1
Number of ports 1 1
Number of terminals 144 144
word count 33554432 words 33554432 words
character code 32000000 32000000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 32MX64 32MX64
Output characteristics 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM
Encapsulate equivalent code DIMM144,32 DIMM144,32
Package shape RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 3.3 V 3.3 V
Certification status Not Qualified Not Qualified
refresh cycle 8192 8192
self refresh YES YES
Maximum standby current 0.008 A 0.008 A
Maximum slew rate 1.28 mA 1.36 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount NO NO
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD
Terminal pitch 0.8 mm 0.8 mm
Terminal location DUAL DUAL
【GD32L233C-START Review】7. PWM LED Driver
For previous posts, please refer to: 【GD32L233C-START Review】1. Unboxing [GD32L233C-START Review] 2. Create a new project step by step [GD32L233C-START Evaluation] 3. Porting FreeRTOS to GD32L233 【GD3...
hehung GD32 MCU
A brief description of the stack structure in the ZigBee standard
The ZigBee standard defines a stack protocol that ensures interoperability of wireless devices in low-cost, low-power, and low-data-rate networks. This article briefly describes the ZigBee stack struc...
Aguilera Wireless Connectivity
[Original] I recently heard that ST's chips have started to increase in price. So can domestic chips rise through this opportunity?
At present, our company basically uses ST chips. If the price of some popular ST chips increases, it may affect the cost of the product. Will you consider replacing them with domestic chips with highe...
w494143467 Domestic Chip Exchange
How to configure DM368 to make the output image horizontally mirrored when using sensor image acquisition
How to configure DM368 to make the output image horizontally mirrored when using sensor image acquisition...
huangyunxiang DSP and ARM Processors
Chat: How does your company control technical documents?
How are the source files of product schematics and PCB diagrams, and the source codes of embedded programs and host computer programs managed and controlled in the company? My previous unit used an in...
mmmllb Talking about work
The Representation and Operation of Numbers in Single Chip Microcomputer
[size=4](1) Number systems: cardinality, decimal, binary, hexadecimal[/size] [size=4](2) Conversion between number systems: decimal to binary, binary to hexadecimal[/size] [size=4](3) Operations betwe...
Aguilera Microcontroller MCU

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号