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WF512K32-70G2UC5A

Description
Flash Module, 512KX32, 70ns, CQFP68, 22.40 MM, 3.50 MM HEIGHT, CERAMIC, QFP-68
Categorystorage    storage   
File Size567KB,16 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WF512K32-70G2UC5A Overview

Flash Module, 512KX32, 70ns, CQFP68, 22.40 MM, 3.50 MM HEIGHT, CERAMIC, QFP-68

WF512K32-70G2UC5A Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeQFP
package instructionQFP,
Contacts68
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time70 ns
Other featuresUSER CONFIGURABLE AS 2M X 8
Spare memory width16
JESD-30 codeS-CQFP-G68
length22.36 mm
memory density16777216 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals68
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height3.51 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width22.36 mm
Base Number Matches1
White Electronic Designs
WF512K32-XXX5
512Kx32 5V FLASH MODULE, SMD 5962-94612
FEATURES
Access Times of 60, 70, 90, 120, 150ns
Packaging
66 pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400
(1)
).
68 lead, 40mm, Low Capacitance Hermetic
CQFP (Package 501)
1
68 lead, 40mm, Low Profile 3.5mm (0.140"),
CQFP (Package 502)
1
68 lead, 22.4mm (0.880") Low Profile CQFP
(G2U) 3.5mm (0.140") high, (Package 510)
1
68 lead, 22.4mm (0.880") CQFP (G2L) 5.08mm
(0.200") high, Package (528)
Commercial, Industrial and Military Temperature
Ranges
5 Volt Programming. 5V ± 10% Supply.
Low Power CMOS, 6.5mA Standby
Embedded Erase and Program Algorithms
TTL Compatible Inputs and CMOS Outputs
Built-in Decoupling Caps for Low Noise Operation
Page Program Operation and Internal Program
Control Time
Weight
WF512K32 - XG2UX5 - 8 grams typical
WF512K32N - XH1X5 - 13 grams typical
WF512K32 - XG4TX5
1
- 20 grams typical
WF512K32-XG2LX5 - 8 grams typical
* This product is subject to change without notice.
Note 1: Package Not Recommended for New Design
See Flash Programming Application Note 4M5 for algorithms.
1,000,000 Erase/Program Cycles Minimum
Sector Architecture
8 equal size sectors of 64KBytes each
Any combination of sectors can be concurrently
erased. Also supports full chip erase
Organized as 512Kx32
FIGURE 1 – PIN CONFIGURATION FOR WF512K32N-XH1X5
Top View
1
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
A
18
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
#
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
A
17
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
#
WE
4
#
I/O
27
A
4
A
5
A
6
WE
3
#
CS
3
#
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
WE
1
# CS
1
#
Pin Description
56
I/O
0-31
A
0-18
WE
1-4
#
CS
1-4
#
OE#
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
Block Diagram
WE
2
# CS
2
#
WE
3
# CS
3
#
WE
4
# CS
4
#
I/O
23
I/O
22
I/O
21
OE#
A
0-18
512K x 8
512K x 8
512K x 8
512K x 8
8
8
8
8
I/O
20
66
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
March 2006
Rev. 11
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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