CDR32BP4R3BCUR datasheet, PDF - EEWORLD Datasheet

CDR32BP4R3BCUR: DescriptionCeramic Capacitor, Multilayer, Ceramic, 100V, 5.81% +Tol, 5.81% -Tol, BP, 30ppm/Cel TC, 0.0000043uF, Surface Mount, 1206, CHIP; CategoryPassive components capacitor; File Size46KB，4 Pages; ManufacturerAVX

Download Datasheet Parametric View All

CDR32BP4R3BCUR Overview

Ceramic Capacitor, Multilayer, Ceramic, 100V, 5.81% +Tol, 5.81% -Tol, BP, 30ppm/Cel TC, 0.0000043uF, Surface Mount, 1206, CHIP

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	AVX
package instruction	CHIP
Reach Compliance Code	not_compliant
ECCN code	EAR99
capacitance	0.0000043 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	1.3 mm
JESD-609 code	e0
length	3.2 mm
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	5.81%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	BULK
positive tolerance	5.81%
Rated (DC) voltage (URdc)	100 V
Guideline	MIL-PRF-55681/8
size code	1206
surface mount	YES
Temperature characteristic code	BP
Temperature Coefficient	30ppm/Cel ppm/°C
Terminal surface	Tin/Lead (Sn/Pb)
Terminal shape	WRAPAROUND
width	1.6 mm
Base Number Matches	1

How can we add isolation to an ADC without compromising its performance?: The following article is from Analog Devices, author ADIThere are three aspects to consider when it comes to isolation:Ensure that the hot end has power from an isolated power sourceIsolate data to en...; btty038 RF/Wirelessly

The Difficulty of Analog IC Design--For Beginners: When you buy an analog IC, you can see a relatively complete block diagram from the datasheet, and the principle is basically clear at a glance. If you understand electronic circuit design, you must t...; xiaobaitu FPGA/CPLD

[[HC32F460 development board review] (Part 2) Review of three low-power modes of the HC32F460 microcontroller: [i=s]This post was last edited by Mengxi Kaiwu on 2021-5-10 13:14[/i]1. IntroductionThe main features of the HC32F460 series products state: CPU dynamic power consumption is 80μA/MHz, and power consum...; 梦溪开物 Domestic Chip Exchange

TI's Sitara AM3352 processor with up to 1 GHz and rich peripheral resources: With the increasing number of terminal devices and the growing demand for large-scale data exchange, data concentrators will face new requirements and challenges in terms of performance and interfaces...; Aguilera Microcontroller MCU

Let’s talk about 5G. Can Huawei achieve the 5G standard?: [align=center][/align] I recently heard that Australia has banned Huawei from providing 5G technology to Australia. China's communications have gone from being a follower to a leader. Can you predict ...; 高进 Talking

ESP-S3-12K (IV) ---- Here comes the ESP-box effect: Well, the effect is here. For the novice of screen clicking, it is not so smooth. The main effect is as follows Failure 1: The height and width are wrongFailure 2: Colors are invertedFailure 3: The X-...; RCSN Domestic Chip Exchange

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components