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HYB18T1G400AC-3

Description
DDR DRAM, 256MX4, 0.45ns, CMOS, PBGA68, 10 X 20 MM, MO-207DM-Z, FBGA-68
Categorystorage    storage   
File Size1MB,95 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Download Datasheet Parametric Compare View All

HYB18T1G400AC-3 Overview

DDR DRAM, 256MX4, 0.45ns, CMOS, PBGA68, 10 X 20 MM, MO-207DM-Z, FBGA-68

HYB18T1G400AC-3 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerInfineon
Parts packaging codeDSBGA
package instructionFBGA,
Contacts68
Reach Compliance Codecompliant
ECCN codeEAR99
access modeMULTI BANK PAGE BURST
Maximum access time0.45 ns
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-PBGA-B68
length20 mm
memory density1073741824 bit
Memory IC TypeDDR DRAM
memory width4
Number of functions1
Number of ports1
Number of terminals68
word count268435456 words
character code256000000
Operating modeSYNCHRONOUS
organize256MX4
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
self refreshYES
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width10 mm
Base Number Matches1

HYB18T1G400AC-3 Related Products

HYB18T1G400AC-3 HYB18T1G400AC-3S HYB18T1G160AC-3 HYB18T1G160AC-3S HYB18T1G800AC-3S HYB18T1G800AC-3
Description DDR DRAM, 256MX4, 0.45ns, CMOS, PBGA68, 10 X 20 MM, MO-207DM-Z, FBGA-68 DDR DRAM, 256MX4, 0.45ns, CMOS, PBGA68, 10 X 20 MM, MO-207DM-Z, FBGA-68 DDR DRAM, 64MX16, 0.45ns, CMOS, PBGA92, 10 X 20 MM, MO-207DL-Z, FBGA-92 DDR DRAM, 64MX16, 0.45ns, CMOS, PBGA92, 10 X 20 MM, MO-207DL-Z, FBGA-92 DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA68, 10 X 20 MM, MO-207DM-Z, FBGA-68 DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA68, 10 X 20 MM, MO-207DM-Z, FBGA-68
Maker Infineon Infineon Infineon Infineon Infineon Infineon
Parts packaging code DSBGA DSBGA DSBGA DSBGA DSBGA DSBGA
package instruction FBGA, FBGA, FBGA, FBGA, FBGA, FBGA,
Contacts 68 68 92 92 68 68
Reach Compliance Code compliant unknown compliant unknown unknown compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST MULTI BANK PAGE BURST MULTI BANK PAGE BURST MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Maximum access time 0.45 ns 0.45 ns 0.45 ns 0.45 ns 0.45 ns 0.45 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code R-PBGA-B68 R-PBGA-B68 R-PBGA-B92 R-PBGA-B92 R-PBGA-B68 R-PBGA-B68
length 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
memory density 1073741824 bit 1073741824 bit 1073741824 bit 1073741824 bit 1073741824 bit 1073741824 bit
Memory IC Type DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM
memory width 4 4 16 16 8 8
Number of functions 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1
Number of terminals 68 68 92 92 68 68
word count 268435456 words 268435456 words 67108864 words 67108864 words 134217728 words 134217728 words
character code 256000000 256000000 64000000 64000000 128000000 128000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
organize 256MX4 256MX4 64MX16 64MX16 128MX8 128MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA FBGA FBGA FBGA FBGA FBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
self refresh YES YES YES YES YES YES
Maximum supply voltage (Vsup) 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Terminal form BALL BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
width 10 mm 10 mm 10 mm 10 mm 10 mm 10 mm
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