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W9825G6KH-5I

Description
Synchronous DRAM, 16MX16, 4.5ns, CMOS, PDSO54, TSOP2-54
Categorystorage    storage   
File Size1MB,42 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Environmental Compliance
Download Datasheet Parametric Compare View All

W9825G6KH-5I Overview

Synchronous DRAM, 16MX16, 4.5ns, CMOS, PDSO54, TSOP2-54

W9825G6KH-5I Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerWinbond Electronics Corporation
package instructionTSOP2,
Reach Compliance Codecompliant
access modeFOUR BANK PAGE BURST
Maximum access time4.5 ns
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-PDSO-G54
length22.22 mm
memory density268435456 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width16
Number of functions1
Number of ports1
Number of terminals54
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize16MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height1.2 mm
self refreshYES
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.16 mm
Base Number Matches1

W9825G6KH-5I Related Products

W9825G6KH-5I W9825G6KH-6 W9825G6KH-6I
Description Synchronous DRAM, 16MX16, 4.5ns, CMOS, PDSO54, TSOP2-54 Memory interface type: Parallel Memory capacity: 256Mb (16M x 16) Operating voltage: 3V ~ 3.6V Memory type: Volatile Memory interface type: Parallel Memory capacity: 256Mb (16M x 16) Operating voltage: 3V ~ 3.6V Memory type: Volatile SDRAM, 256Mb (32MB, 16Mbx16), 3.3v industrial grade -40°C~85°C, 166MHz/CL3 or 133MHz/CL2
Is it Rohs certified? conform to conform to conform to
Maker Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation
package instruction TSOP2, TSOP2, TSOP2,
Reach Compliance Code compliant compliant compliant
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 4.5 ns 5 ns 5 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code R-PDSO-G54 R-PDSO-G54 R-PDSO-G54
length 22.22 mm 22.22 mm 22.22 mm
memory density 268435456 bit 268435456 bit 268435456 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
memory width 16 16 16
Number of functions 1 1 1
Number of ports 1 1 1
Number of terminals 54 54 54
word count 16777216 words 16777216 words 16777216 words
character code 16000000 16000000 16000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 85 °C
Minimum operating temperature -40 °C - -40 °C
organize 16MX16 16MX16 16MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 TSOP2 TSOP2
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Maximum seat height 1.2 mm 1.2 mm 1.2 mm
self refresh YES YES YES
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING
Terminal pitch 0.8 mm 0.8 mm 0.8 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 10.16 mm 10.16 mm 10.16 mm

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