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IDT72261L20PFI |
IDT72271L20PFI |
IDT72261L20TFI |
IDT72271L20TFI |
Description |
FIFO, 16KX9, 12ns, Synchronous, CMOS, PQFP64, TQFP-64 |
FIFO, 32KX9, 12ns, Synchronous, CMOS, PQFP64, TQFP-64 |
FIFO, 16KX9, 12ns, Synchronous, CMOS, PQFP64, STQFP-64 |
FIFO, 32KX9, 12ns, Synchronous, CMOS, PQFP64, STQFP-64 |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
Parts packaging code |
QFP |
QFP |
QFP |
QFP |
package instruction |
TQFP-64 |
TQFP-64 |
STQFP-64 |
STQFP-64 |
Contacts |
64 |
64 |
64 |
64 |
Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
_compli |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Maximum access time |
12 ns |
12 ns |
12 ns |
12 ns |
Other features |
RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH |
RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH |
RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH |
RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH |
Maximum clock frequency (fCLK) |
50 MHz |
50 MHz |
50 MHz |
50 MHz |
period time |
20 ns |
20 ns |
20 ns |
20 ns |
JESD-30 code |
S-PQFP-G64 |
S-PQFP-G64 |
S-PQFP-G64 |
S-PQFP-G64 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
length |
14 mm |
14 mm |
10 mm |
10 mm |
memory density |
147456 bit |
294912 bit |
147456 bit |
294912 bi |
Memory IC Type |
OTHER FIFO |
OTHER FIFO |
OTHER FIFO |
OTHER FIFO |
memory width |
9 |
9 |
9 |
9 |
Humidity sensitivity level |
3 |
3 |
3 |
3 |
Number of functions |
1 |
1 |
1 |
1 |
Number of terminals |
64 |
64 |
64 |
64 |
word count |
16384 words |
32768 words |
16384 words |
32768 words |
character code |
16000 |
32000 |
16000 |
32000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
organize |
16KX9 |
32KX9 |
16KX9 |
32KX9 |
Exportable |
YES |
YES |
YES |
YES |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
LQFP |
LQFP |
LFQFP |
LFQFP |
Encapsulate equivalent code |
QFP64,.66SQ,32 |
QFP64,.66SQ,32 |
QFP64,.47SQ,20 |
QFP64,.47SQ,20 |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
FLATPACK, LOW PROFILE |
FLATPACK, LOW PROFILE |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
power supply |
5 V |
5 V |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.6 mm |
1.6 mm |
1.6 mm |
1.6 mm |
Maximum standby current |
0.015 A |
0.015 A |
0.015 A |
0.015 A |
Maximum slew rate |
0.15 mA |
0.15 mA |
0.15 mA |
0.15 mA |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.8 mm |
0.8 mm |
0.5 mm |
0.5 mm |
Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
width |
14 mm |
14 mm |
10 mm |
10 mm |
Maker |
- |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |