Time Slot Assigner, PBGA217, PLASTIC, BGA-217
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | BGA |
package instruction | BGA, BGA217,17X17,50 |
Contacts | 217 |
Reach Compliance Code | compliant |
JESD-30 code | S-PBGA-B217 |
JESD-609 code | e0 |
length | 23 mm |
Number of functions | 1 |
Number of terminals | 217 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA217,17X17,50 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 2.32 mm |
Maximum slew rate | 0.275 mA |
Nominal supply voltage | 3.3 V |
surface mount | YES |
Telecom integrated circuit types | TIME SLOT ASSIGNER |
Temperature level | INDUSTRIAL |
Terminal surface | TIN LEAD |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 23 mm |
Base Number Matches | 1 |