SRAM Module, 2MX8, 85ns, CMOS
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 85 ns |
I/O type | COMMON |
JESD-30 code | R-XSMA-T36 |
JESD-609 code | e0 |
memory density | 16777216 bit |
Memory IC Type | SRAM MODULE |
memory width | 8 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 36 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2MX8 |
Output characteristics | 3-STATE |
Exportable | YES |
Package body material | UNSPECIFIED |
Encapsulate equivalent code | SIP36 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.0008 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.11 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal location | SINGLE |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Base Number Matches | 1 |