HX6409TBRT datasheet, PDF - EEWORLD Datasheet

HX6409TBRT: DescriptionFIFO, 4KX9, 30ns, Synchronous, CMOS, CDFP32, CERAMIC, DFP-32; Categorystorage storage; File Size879KB，16 Pages; ManufacturerHoneywell; Websitehttp://www.ssec.honeywell.com/

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HX6409TBRT Overview

FIFO, 4KX9, 30ns, Synchronous, CMOS, CDFP32, CERAMIC, DFP-32

Parameter Name	Attribute value
Parts packaging code	DFP
package instruction	DFP, FL32,.6
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	30 ns
Maximum clock frequency (fCLK)	29.4 MHz
period time	36 ns
JESD-30 code	R-CDFP-F32
length	20.828 mm
memory density	36864 bit
Memory IC Type	OTHER FIFO
memory width	9
Number of functions	1
Number of terminals	32
word count	4096 words
character code	4000
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	4KX9
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP
Encapsulate equivalent code	FL32,.6
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B
Maximum seat height	3.81 mm
Maximum standby current	0.0005 A
Maximum slew rate	0.5 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.524 mm
Terminal location	DUAL
total dose	100k Rad(Si) V
width	15.24 mm
Base Number Matches	1

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