COPEG888-XXX/V
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | QCCJ, LDCC44,.7SQ |
Reach Compliance Code | compliant |
bit size | 8 |
CPU series | COP800 |
JESD-30 code | S-PQCC-J44 |
JESD-609 code | e0 |
Humidity sensitivity level | 2A |
Number of terminals | 44 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC44,.7SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
power supply | 3/5 V |
Certification status | Not Qualified |
RAM (bytes) | 256 |
rom(word) | 8192 |
ROM programmability | MROM |
Maximum slew rate | 12.5 mA |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn85Pb15) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Base Number Matches | 1 |
COPEG888-XXX/V | COPEG888-XXX/N | COPEG884-XXX/N | COPEG884-XXX/WM | COPCG888-XXX/N | COPCG888-XXX/V | COPCG888XXX/DWF | |
---|---|---|---|---|---|---|---|
Description | COPEG888-XXX/V | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,40PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,28PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,SOP,28PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,40PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,LDCC,44PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,WAFER |
package instruction | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | DIP, DIP28,.6 | SOP, SOP28,.4 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | , WAFER |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | unknown |
bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
CPU series | COP800 | COP800 | COP800 | COP800 | COP800 | COP800 | COP800 |
Encapsulate equivalent code | LDCC44,.7SQ | DIP40,.6 | DIP28,.6 | SOP28,.4 | DIP40,.6 | LDCC44,.7SQ | WAFER |
power supply | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM (bytes) | 256 | 256 | 256 | 256 | 128 | 128 | 128 |
rom(word) | 8192 | 8192 | 4096 | 4096 | 4096 | 4096 | 4096 |
ROM programmability | MROM | MROM | MROM | MROM | MROM | MROM | MROM |
Maximum slew rate | 12.5 mA | 12.5 mA | 12.5 mA | 12.5 mA | 12.5 mA | 12.5 mA | 12.5 mA |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | - |
JESD-30 code | S-PQCC-J44 | R-PDIP-T40 | R-PDIP-T28 | R-PDSO-G28 | R-PDIP-T40 | S-PQCC-J44 | - |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | - |
Humidity sensitivity level | 2A | 1 | 1 | 2A | 1 | 2A | - |
Number of terminals | 44 | 40 | 28 | 28 | 40 | 44 | - |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
encapsulated code | QCCJ | DIP | DIP | SOP | DIP | QCCJ | - |
Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | - |
Package form | CHIP CARRIER | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | CHIP CARRIER | - |
surface mount | YES | NO | NO | YES | NO | YES | - |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
Terminal surface | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - |
Terminal form | J BEND | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | J BEND | - |
Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | - |
Terminal location | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD | - |
Base Number Matches | 1 | 1 | 1 | 1 | - | - | - |