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COPEG888-XXX/V

Description
COPEG888-XXX/V
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size532KB,53 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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COPEG888-XXX/V Overview

COPEG888-XXX/V

COPEG888-XXX/V Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionQCCJ, LDCC44,.7SQ
Reach Compliance Codecompliant
bit size8
CPU seriesCOP800
JESD-30 codeS-PQCC-J44
JESD-609 codee0
Humidity sensitivity level2A
Number of terminals44
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC44,.7SQ
Package shapeSQUARE
Package formCHIP CARRIER
power supply3/5 V
Certification statusNot Qualified
RAM (bytes)256
rom(word)8192
ROM programmabilityMROM
Maximum slew rate12.5 mA
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Base Number Matches1

COPEG888-XXX/V Related Products

COPEG888-XXX/V COPEG888-XXX/N COPEG884-XXX/N COPEG884-XXX/WM COPCG888-XXX/N COPCG888-XXX/V COPCG888XXX/DWF
Description COPEG888-XXX/V IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,40PIN,PLASTIC IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,28PIN,PLASTIC IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,SOP,28PIN,PLASTIC IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,40PIN,PLASTIC IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,LDCC,44PIN,PLASTIC IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,WAFER
package instruction QCCJ, LDCC44,.7SQ DIP, DIP40,.6 DIP, DIP28,.6 SOP, SOP28,.4 DIP, DIP40,.6 QCCJ, LDCC44,.7SQ , WAFER
Reach Compliance Code compliant compliant compliant compliant compliant compliant unknown
bit size 8 8 8 8 8 8 8
CPU series COP800 COP800 COP800 COP800 COP800 COP800 COP800
Encapsulate equivalent code LDCC44,.7SQ DIP40,.6 DIP28,.6 SOP28,.4 DIP40,.6 LDCC44,.7SQ WAFER
power supply 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 256 256 256 256 128 128 128
rom(word) 8192 8192 4096 4096 4096 4096 4096
ROM programmability MROM MROM MROM MROM MROM MROM MROM
Maximum slew rate 12.5 mA 12.5 mA 12.5 mA 12.5 mA 12.5 mA 12.5 mA 12.5 mA
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible -
JESD-30 code S-PQCC-J44 R-PDIP-T40 R-PDIP-T28 R-PDSO-G28 R-PDIP-T40 S-PQCC-J44 -
JESD-609 code e0 e0 e0 e0 e0 e0 -
Humidity sensitivity level 2A 1 1 2A 1 2A -
Number of terminals 44 40 28 28 40 44 -
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C -
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code QCCJ DIP DIP SOP DIP QCCJ -
Package shape SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE -
Package form CHIP CARRIER IN-LINE IN-LINE SMALL OUTLINE IN-LINE CHIP CARRIER -
surface mount YES NO NO YES NO YES -
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL -
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) -
Terminal form J BEND THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE J BEND -
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm -
Terminal location QUAD DUAL DUAL DUAL DUAL QUAD -
Base Number Matches 1 1 1 1 - - -

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