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COPEG884-XXX/WM

Description
IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,SOP,28PIN,PLASTIC
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size532KB,53 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

COPEG884-XXX/WM Overview

IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,SOP,28PIN,PLASTIC

COPEG884-XXX/WM Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionSOP, SOP28,.4
Reach Compliance Codecompliant
bit size8
CPU seriesCOP800
JESD-30 codeR-PDSO-G28
JESD-609 codee0
Humidity sensitivity level2A
Number of terminals28
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP28,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
power supply3/5 V
Certification statusNot Qualified
RAM (bytes)256
rom(word)4096
ROM programmabilityMROM
Maximum slew rate12.5 mA
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Base Number Matches1

COPEG884-XXX/WM Related Products

COPEG884-XXX/WM COPEG888-XXX/V COPEG888-XXX/N COPEG884-XXX/N COPCG888-XXX/N COPCG888-XXX/V COPCG888XXX/DWF
Description IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,SOP,28PIN,PLASTIC COPEG888-XXX/V IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,40PIN,PLASTIC IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,28PIN,PLASTIC IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,40PIN,PLASTIC IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,LDCC,44PIN,PLASTIC IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,WAFER
package instruction SOP, SOP28,.4 QCCJ, LDCC44,.7SQ DIP, DIP40,.6 DIP, DIP28,.6 DIP, DIP40,.6 QCCJ, LDCC44,.7SQ , WAFER
Reach Compliance Code compliant compliant compliant compliant compliant compliant unknown
bit size 8 8 8 8 8 8 8
CPU series COP800 COP800 COP800 COP800 COP800 COP800 COP800
Encapsulate equivalent code SOP28,.4 LDCC44,.7SQ DIP40,.6 DIP28,.6 DIP40,.6 LDCC44,.7SQ WAFER
power supply 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 256 256 256 256 128 128 128
rom(word) 4096 8192 8192 4096 4096 4096 4096
ROM programmability MROM MROM MROM MROM MROM MROM MROM
Maximum slew rate 12.5 mA 12.5 mA 12.5 mA 12.5 mA 12.5 mA 12.5 mA 12.5 mA
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible -
JESD-30 code R-PDSO-G28 S-PQCC-J44 R-PDIP-T40 R-PDIP-T28 R-PDIP-T40 S-PQCC-J44 -
JESD-609 code e0 e0 e0 e0 e0 e0 -
Humidity sensitivity level 2A 2A 1 1 1 2A -
Number of terminals 28 44 40 28 40 44 -
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C -
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code SOP QCCJ DIP DIP DIP QCCJ -
Package shape RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR SQUARE -
Package form SMALL OUTLINE CHIP CARRIER IN-LINE IN-LINE IN-LINE CHIP CARRIER -
surface mount YES YES NO NO NO YES -
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL -
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) -
Terminal form GULL WING J BEND THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE J BEND -
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm -
Terminal location DUAL QUAD DUAL DUAL DUAL QUAD -
Base Number Matches 1 1 1 1 - - -

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