19-Vpp Mono Class-D Audio Amplifier for Piezo/Ceramic Speakers (TPA2100) 16-DSBGA
Parameter Name | Attribute value |
Brand Name | Texas Instruments |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Texas Instruments |
Parts packaging code | BGA |
package instruction | WCSP-16 |
Contacts | 16 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Factory Lead Time | 1 week |
Nominal bandwidth | 20 kHz |
Commercial integrated circuit types | AUDIO AMPLIFIER |
Gain | 24 dB |
JESD-30 code | S-PBGA-B16 |
JESD-609 code | e1 |
length | 2.295 mm |
Humidity sensitivity level | 1 |
Number of channels | 1 |
Number of functions | 1 |
Number of terminals | 16 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Encapsulate equivalent code | BGA16,4X4,20 |
Package shape | SQUARE |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3/5 V |
Certification status | Not Qualified |
Maximum seat height | 0.625 mm |
Maximum slew rate | 9 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 2.5 V |
surface mount | YES |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 0.5 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 2.295 mm |
Base Number Matches | 1 |
TPA2100P1YZHR | TPA2100P1YZHT | |
---|---|---|
Description | 19-Vpp Mono Class-D Audio Amplifier for Piezo/Ceramic Speakers (TPA2100) 16-DSBGA | 19-Vpp Mono Class-D Audio Amplifier for Piezo/Ceramic Speakers (TPA2100) 16-DSBGA |
Brand Name | Texas Instruments | Texas Instruments |
Is it lead-free? | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to |
Parts packaging code | BGA | BGA |
package instruction | WCSP-16 | VFBGA, BGA16,4X4,20 |
Contacts | 16 | 16 |
Reach Compliance Code | compliant | compli |
ECCN code | EAR99 | EAR99 |
Factory Lead Time | 1 week | 1 week |
Nominal bandwidth | 20 kHz | 20 kHz |
Commercial integrated circuit types | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
Gain | 24 dB | 24 dB |
JESD-30 code | S-PBGA-B16 | S-XBGA-B16 |
JESD-609 code | e1 | e1 |
length | 2.295 mm | 2.295 mm |
Humidity sensitivity level | 1 | 1 |
Number of channels | 1 | 1 |
Number of functions | 1 | 1 |
Number of terminals | 16 | 16 |
Maximum operating temperature | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | UNSPECIFIED |
encapsulated code | VFBGA | VFBGA |
Encapsulate equivalent code | BGA16,4X4,20 | BGA16,4X4,20 |
Package shape | SQUARE | SQUARE |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 260 | 260 |
power supply | 3/5 V | 3/5 V |
Certification status | Not Qualified | Not Qualified |
Maximum seat height | 0.625 mm | 0.625 mm |
Maximum slew rate | 9 mA | 9 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 2.5 V | 2.5 V |
surface mount | YES | YES |
Temperature level | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL | BALL |
Terminal pitch | 0.5 mm | 0.5 mm |
Terminal location | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
width | 2.295 mm | 2.295 mm |
Base Number Matches | 1 | 1 |
Part Number | Manufacturer | Description |
---|---|---|
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