TPA2011D1YFFT datasheet, PDF - EEWORLD Datasheet

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TPA2011D1YFFT: Description3.2W mono class-d with auto-recovering short-circuit protection 9-DSBGA -40 to 85; CategoryAnalog mixed-signal IC Consumption circuit; File Size1MB，30 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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3.2W mono class-d with auto-recovering short-circuit protection 9-DSBGA -40 to 85

TPA2011D1YFFT Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	VFBGA, BGA9,3X3,16
Contacts	9
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	1 week
Nominal bandwidth	20 kHz
Commercial integrated circuit types	AUDIO AMPLIFIER
JESD-30 code	S-XBGA-B9
JESD-609 code	e1
length	1.6 mm
Humidity sensitivity level	1
Number of channels	1
Number of functions	1
Number of terminals	9
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Nominal output power	3.24 W
Package body material	UNSPECIFIED
encapsulated code	VFBGA
Encapsulate equivalent code	BGA9,3X3,16
Package shape	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	0.625 mm
Maximum slew rate	2.5 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.5 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.4 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	1.6 mm
Base Number Matches	1

TPA2011D1YFFT Related Products

	TPA2011D1YFFT	TPA2011D1YFFR
Description	3.2W mono class-d with auto-recovering short-circuit protection 9-DSBGA -40 to 85	3.2W mono class-d with auto-recovering short-circuit protection 9-DSBGA -40 to 85
Brand Name	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
Parts packaging code	BGA	BGA
package instruction	VFBGA, BGA9,3X3,16	VFBGA, BGA9,3X3,16
Contacts	9	9
Reach Compliance Code	compli	compli
ECCN code	EAR99	EAR99
Factory Lead Time	1 week	6 weeks
Nominal bandwidth	20 kHz	20 kHz
Commercial integrated circuit types	AUDIO AMPLIFIER	AUDIO AMPLIFIER
JESD-30 code	S-XBGA-B9	S-XBGA-B9
JESD-609 code	e1	e1
length	1.6 mm	1.6 mm
Humidity sensitivity level	1	1
Number of channels	1	1
Number of functions	1	1
Number of terminals	9	9
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Nominal output power	3.24 W	3.24 W
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	VFBGA	VFBGA
Encapsulate equivalent code	BGA9,3X3,16	BGA9,3X3,16
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260
power supply	3/5 V	3/5 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	0.625 mm	0.625 mm
Maximum slew rate	2.5 mA	2.5 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2.5 V	2.5 V
surface mount	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL
Terminal pitch	0.4 mm	0.4 mm
Terminal location	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	1.6 mm	1.6 mm
Base Number Matches	1	1

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