NS32440VX datasheet, PDF - EEWORLD Datasheet

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NS32440VX: DescriptionSPECIALTY MICROPROCESSOR CIRCUIT, PQCC28, PLASTIC, CC-28; CategoryThe embedded processor and controller Microcontrollers and processors; File Size301KB，9 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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NS32440VX Overview

SPECIALTY MICROPROCESSOR CIRCUIT, PQCC28, PLASTIC, CC-28

NS32440VX Parametric

Parameter Name	Attribute value
package instruction	QCCJ,
Reach Compliance Code	unknown
JESD-30 code	S-PQCC-J28
length	11.43 mm
Number of terminals	28
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Package shape	SQUARE
Package form	CHIP CARRIER
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	YES
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
width	11.43 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT
Base Number Matches	1

NS32440VX Related Products

	NS32440VX	NS32440V	DP8340J	DP8340N	DP8340V	DP8340VX	NS32440J	NS32440N
Description	SPECIALTY MICROPROCESSOR CIRCUIT, PQCC28, PLASTIC, CC-28	SPECIALTY MICROPROCESSOR CIRCUIT, PQCC28, PLASTIC, CC-28	SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24, CERAMIC, DIP-24	SPECIALTY MICROPROCESSOR CIRCUIT, PDIP24, PLASTIC, DIP-24	SPECIALTY MICROPROCESSOR CIRCUIT, PQCC28, PLASTIC, CC-28	SPECIALTY MICROPROCESSOR CIRCUIT, PQCC28, PLASTIC, CC-28	SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24, CERAMIC, DIP-24	SPECIALTY MICROPROCESSOR CIRCUIT, PDIP24, PLASTIC, DIP-24
package instruction	QCCJ,	QCCJ,	DIP, DIP24,.6	DIP, DIP24,.6	QCCJ, LDCC28,.5SQ	QCCJ,	DIP,	DIP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	S-PQCC-J28	S-PQCC-J28	R-GDIP-T24	R-PDIP-T24	S-PQCC-J28	S-PQCC-J28	R-GDIP-T24	R-PDIP-T24
Number of terminals	28	28	24	24	28	28	24	24
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ	DIP	DIP	QCCJ	QCCJ	DIP	DIP
Package shape	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	4.57 mm	4.572 mm	5.334 mm	4.57 mm	4.57 mm	4.572 mm	5.334 mm
Maximum supply voltage	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	NO	YES	YES	NO	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	QUAD	QUAD	DUAL	DUAL	QUAD	QUAD	DUAL	DUAL
width	11.43 mm	11.43 mm	15.24 mm	15.24 mm	11.43 mm	11.43 mm	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT
length	11.43 mm	11.43 mm	-	31.915 mm	11.43 mm	11.43 mm	-	31.915 mm
Base Number Matches	1	1	1	1	1	1	-	-
Maker	-	-	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments

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