IC,MICROPROCESSOR,32-BIT,CMOS,LDCC,84PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | QCCJ, LDCC84,1.2SQ |
Contacts | 84 |
Reach Compliance Code | not_compliant |
bit size | 32 |
JESD-30 code | S-PQCC-J84 |
JESD-609 code | e0 |
Number of terminals | 84 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC84,1.2SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
power supply | 5 V |
Certification status | Not Qualified |
speed | 20 MHz |
Maximum slew rate | 210.5 mA |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
Base Number Matches | 1 |
IMST425-J20S | IMST425-G17M | IMST425-G17S | IMST425-G20M | IMST425-G20S | IMST425-J17S | |
---|---|---|---|---|---|---|
Description | IC,MICROPROCESSOR,32-BIT,CMOS,LDCC,84PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,CMOS,PGA,84PIN,CERAMIC | IC,MICROPROCESSOR,32-BIT,CMOS,PGA,84PIN,CERAMIC | IC,MICROPROCESSOR,32-BIT,CMOS,PGA,84PIN,CERAMIC | IC,MICROPROCESSOR,32-BIT,CMOS,PGA,84PIN,CERAMIC | IC,MICROPROCESSOR,32-BIT,CMOS,LDCC,84PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Contacts | 84 | 84 | 84 | 84 | 84 | 84 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
bit size | 32 | 32 | 32 | 32 | 32 | 32 |
JESD-30 code | S-PQCC-J84 | S-XPGA-P84 | S-XPGA-P84 | S-XPGA-P84 | S-XPGA-P84 | S-PQCC-J84 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
Number of terminals | 84 | 84 | 84 | 84 | 84 | 84 |
Maximum operating temperature | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C |
Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
encapsulated code | QCCJ | PGA | PGA | PGA | PGA | QCCJ |
Encapsulate equivalent code | LDCC84,1.2SQ | PGA84,10X10 | PGA84,10X10 | PGA84,10X10 | PGA84,10X10 | LDCC84,1.2SQ |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | CHIP CARRIER | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | CHIP CARRIER |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
speed | 20 MHz | 17.5 MHz | 17.5 MHz | 20 MHz | 20 MHz | 17.5 MHz |
Maximum slew rate | 210.5 mA | 210.5 mA | 210.5 mA | 210.5 mA | 210.5 mA | 210.5 mA |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | NO | NO | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | J BEND |
Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | QUAD |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
Parts packaging code | - | PGA | PGA | PGA | PGA | - |