8-input NAND Gates
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Renesas Electronics Corporation |
| Parts packaging code | DIP |
| package instruction | 6.30 X 19.20 MM, 2.54 MM PITCH, PLASTIC, DIP-14 |
| Contacts | 14 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Is Samacsys | N |
| series | HC/UH |
| JESD-30 code | R-PDIP-T14 |
| length | 19.2 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.004 A |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of entries | 8 |
| Number of terminals | 14 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 2/6 V |
| Prop。Delay @ Nom-Su | 33 ns |
| propagation delay (tpd) | 165 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 5.06 mm |
| Maximum supply voltage (Vsup) | 6 V |
| Minimum supply voltage (Vsup) | 2 V |
| Nominal supply voltage (Vsup) | 4.5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| HD74HC30P | HD74HC30 | HD74HC30FPEL | HD74HC30RPEL | HD74HC30TELL | |
|---|---|---|---|---|---|
| Description | 8-input NAND Gates | 8-input NAND Gates | 8-input NAND Gates | 8-input NAND Gates | 8-input NAND Gates |
| Is it lead-free? | Lead free | - | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | - | conform to | conform to | conform to |
| Maker | Renesas Electronics Corporation | - | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| Parts packaging code | DIP | - | SOIC | SOIC | TSSOP |
| package instruction | 6.30 X 19.20 MM, 2.54 MM PITCH, PLASTIC, DIP-14 | - | 5.50 X 10.06 MM, 1.27 MM PITCH, PLASTIC, SOP-14 | 3.95 X 8.65 MM, 1.27 MM PITCH, PLASTIC, SOP-14 | 4.4 X 5 MM, 0.65 MM PITCH, PLASTIC, TSSOP-14 |
| Contacts | 14 | - | 14 | 14 | 14 |
| Reach Compliance Code | unknow | - | compliant | compli | compli |
| ECCN code | EAR99 | - | EAR99 | EAR99 | EAR99 |
| Is Samacsys | N | - | - | N | N |
| series | HC/UH | - | HC/UH | HC/UH | HC/UH |
| JESD-30 code | R-PDIP-T14 | - | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| length | 19.2 mm | - | 10.06 mm | 8.65 mm | 5 mm |
| Load capacitance (CL) | 50 pF | - | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | NAND GATE | - | NAND GATE | NAND GATE | NAND GATE |
| MaximumI(ol) | 0.004 A | - | 0.004 A | 0.004 A | 0.004 A |
| Humidity sensitivity level | 1 | - | 1 | 1 | 1 |
| Number of functions | 1 | - | 1 | 1 | 1 |
| Number of entries | 8 | - | 8 | 8 | 8 |
| Number of terminals | 14 | - | 14 | 14 | 14 |
| Maximum operating temperature | 85 °C | - | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | - | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | - | SOP | SOP | TSSOP |
| Encapsulate equivalent code | DIP14,.3 | - | SOP14,.3 | SOP14,.25 | TSSOP14,.25 |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | 260 | 260 | 260 |
| power supply | 2/6 V | - | 2/6 V | 2/6 V | 2/6 V |
| Prop。Delay @ Nom-Su | 33 ns | - | - | 33 ns | 33 ns |
| propagation delay (tpd) | 165 ns | - | 165 ns | 165 ns | 165 ns |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | - | NO | NO | NO |
| Maximum seat height | 5.06 mm | - | 2.2 mm | 1.75 mm | 1.1 mm |
| Maximum supply voltage (Vsup) | 6 V | - | 6 V | 6 V | 6 V |
| Minimum supply voltage (Vsup) | 2 V | - | 2 V | 2 V | 2 V |
| Nominal supply voltage (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
| surface mount | NO | - | YES | YES | YES |
| technology | CMOS | - | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | THROUGH-HOLE | - | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | - | 1.27 mm | 1.27 mm | 0.65 mm |
| Terminal location | DUAL | - | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | - | 5.5 mm | 3.95 mm | 4.4 mm |
| Base Number Matches | 1 | - | 1 | 1 | 1 |
| method of packing | - | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
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