RISC Microcontroller, 32-Bit, 100MHz, PQFP208, 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | QFP |
package instruction | FQFP, QFP208,1.2SQ,20 |
Contacts | 208 |
Reach Compliance Code | not_compliant |
ECCN code | 3A001.A.3 |
Has ADC | NO |
Address bus width | 32 |
bit size | 32 |
maximum clock frequency | 50 MHz |
DAC channel | NO |
DMA channel | YES |
External data bus width | 32 |
JESD-30 code | S-PQFP-G208 |
JESD-609 code | e0 |
length | 28 mm |
Humidity sensitivity level | 3 |
Number of I/O lines | 8 |
Number of terminals | 208 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
PWM channel | NO |
Package body material | PLASTIC/EPOXY |
encapsulated code | FQFP |
Encapsulate equivalent code | QFP208,1.2SQ,20 |
Package shape | SQUARE |
Package form | FLATPACK, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 4.1 mm |
speed | 100 MHz |
Maximum slew rate | 480 mA |
Maximum supply voltage | 3.465 V |
Minimum supply voltage | 3.135 V |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn85Pb15) |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 28 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER, RISC |
Base Number Matches | 1 |
IDT79RC32V332-100DPI | 79RC32V334-133BB | 79RC32V334-133BBI | IDT79RC32V332-133DPI | 79RC32V334-100BBI | |
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Description | RISC Microcontroller, 32-Bit, 100MHz, PQFP208, 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208 | 32-BIT, 133MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | 32-BIT, 133MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | RISC Microcontroller, 32-Bit, 133MHz, PQFP208, 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208 | 32-BIT, 100 MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | QFP | BGA | BGA | QFP | BGA |
package instruction | FQFP, QFP208,1.2SQ,20 | 27 X 27 MM, PLASTIC, BGA-256 | 27 X 27 MM, PLASTIC, BGA-256 | FQFP, QFP208,1.2SQ,20 | 27 X 27 MM, PLASTIC, BGA-256 |
Contacts | 208 | 256 | 256 | 208 | 256 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
Address bus width | 32 | 32 | 32 | 32 | 32 |
bit size | 32 | 32 | 32 | 32 | 32 |
maximum clock frequency | 50 MHz | 66.67 MHz | 66.67 MHz | 66.66 MHz | 50 MHz |
External data bus width | 32 | 32 | 32 | 32 | 32 |
JESD-30 code | S-PQFP-G208 | S-PBGA-B256 | S-PBGA-B256 | S-PQFP-G208 | S-PBGA-B256 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
length | 28 mm | 17 mm | 17 mm | 28 mm | 17 mm |
Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 |
Number of terminals | 208 | 256 | 256 | 208 | 256 |
Maximum operating temperature | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | - | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | FQFP | BGA | BGA | FQFP | BGA |
Encapsulate equivalent code | QFP208,1.2SQ,20 | BGA256,16X16,40 | BGA256,16X16,40 | QFP208,1.2SQ,20 | BGA256,16X16,40 |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | FLATPACK, FINE PITCH | GRID ARRAY | GRID ARRAY | FLATPACK, FINE PITCH | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | 225 | 225 | NOT SPECIFIED | 225 |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 4.1 mm | 3.5 mm | 3.5 mm | 4.1 mm | 3.5 mm |
speed | 100 MHz | 133 MHz | 133 MHz | 133 MHz | 100 MHz |
Maximum slew rate | 480 mA | 630 mA | 630 mA | 630 mA | 480 mA |
Maximum supply voltage | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
Minimum supply voltage | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
Nominal supply voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES |
Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn63Pb37) |
Terminal form | GULL WING | BALL | BALL | GULL WING | BALL |
Terminal pitch | 0.5 mm | 1 mm | 1 mm | 0.5 mm | 1 mm |
Terminal location | QUAD | BOTTOM | BOTTOM | QUAD | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | 20 | 20 | NOT SPECIFIED | 20 |
width | 28 mm | 17 mm | 17 mm | 28 mm | 17 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROCONTROLLER, RISC | MICROPROCESSOR, RISC |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
Maker | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
boundary scan | - | YES | YES | - | YES |
Format | - | FIXED POINT | FIXED POINT | - | FIXED POINT |
Integrated cache | - | YES | YES | - | YES |
low power mode | - | YES | YES | - | YES |