Type CC Low Resistance Precision Chip Resistors
Page 1 of 2
•
Style FC
- Flip Chip version for surface mount applications.
Style WB
- Wire Bond version for hybrid applications with metallized back
surface for solder down heat sinking of the chip, includes bondable termination
pads to receive aluminum wire bonds.
• Thermal resistance is provided to optimize high power designs when utilizing
higher thermal conductivity circuit board substrates such as IMS or Alumina.
• Resistance range down to 0.010 ohm at ±5%, 0.050 ohm at ±2%,
and 0.10 ohm at ±1%.
• Low inductance provides excellent high frequency and pulse response.
• High pulse handling and overload capability.
• Best choice for switching power supplies, motor speed controls, and high
current sensing applications.
Style FC - Flip Chip Version
is a surface mount version with solderable pads for
flip chip
soldering.
Resistance
Model
Min.
0.010
Ω
0.020
Ω
0.020
Ω
0.010
Ω
0.025
Ω
Max.
0.015
Ω
10.0
Ω
10.0
Ω
0.020
Ω
10.0
Ω
Power Capability Information
General Applications High Power Applications
Thermal Resistance -
R
θJC
Power Rating
Film (J) to Solder Pad (C)
at 70° C
(see note 2)
(see note 1)
Max. Chip
Temperature
Dimensions in inches and (millimeters)
A
.150
±.007
(3.81
±.18)
.150
±.007
(3.81
±.18)
.200
±.007
(5.08
±.18)
.250
±.007
(6.35
±.18)
.250
±.007
(6.35
±.18)
B
.120
±.007
(3.05
±.18)
.120
±.007
(3.05
±.18)
.150
±.007
(3.81
±.18)
.200
±.007
(5.08
±.18)
.200
±.007
(5.08
±.18)
C
.027
±.005
(.69
±.13)
.022
±.003
(.56
±.08)
.027
±.003
(.69
±.08)
.032
±.005
(.81
±.13)
.041
±.004
(1.04
±.10)
D
.035 min.
(0.89 min.)
.035 min.
(0.89 min.)
.050 min.
(1.27 min.)
.065 min.
(1.66 min.)
.040 min.
(1.02 min.)
Comments
CC1512FC
CC2015FC
CC2520FC
0.75 Watt
0.75 Watt
1.0 Watt
1.5 Watts
1.5 Watts
22.7°C/Watt
22.7°C/Watt
16.0°C/Watt
13.0°C/Watt
11.5°C/Watt
150°C
150°C
150°C
150°C
150°C
Solder Coated Pads
Solderable Pads
Solderable Pads
Solder Coated Pads
Solderable Pads
Style FC Derating Curve For General Applications
100
RATED LOAD, %
CC1512FC Standard Resistance Values:
Tolerance CC1512FC ±1% Standard (except as noted).
5%
5%
5%
5%
5%
0.033
Ω
0.040
Ω
0.050
Ω
0.075
Ω
0.10
Ω
0.15
Ω
5%
5%
2%
2%
0.20
Ω
0.25
Ω
0.30
Ω
0.33
Ω
0.40
Ω
0.50
Ω
0.75
Ω
1.00
Ω
1.50
Ω
2.00
Ω
2.50
Ω
3.00
Ω
3.30
Ω
4.00
Ω
5.00
Ω
7.50
Ω
8.00
Ω
10.0
Ω
0.010
Ω
0.015
Ω
0.020
Ω
0.025
Ω
0.030
Ω
80
60
40
20
0
25
70
100
150
AMBIENT TEMPERATURE,
o
C
Note 1: General Applications -
The power rating
for general applications is based upon 0.5 sq. in.
(300 mm
2
) of termination pad or trace area (2 oz.
copper) connected to each end of the resistor.
Maximum chip temperature is 150°C. Use Derating
Curve to derate appropriately for the maximum
ambient temperature and for the temperature
limitations of the adjacent materials.
CC2015FC Standard Resistance Values:
0.020
Ω
5%
0.025
Ω
5%
0.030
Ω
5%
0.033
Ω
0.040
Ω
0.050
Ω
0.075
Ω
0.10
Ω
0.15
Ω
5%
5%
2%
2%
0.20
Ω
0.25
Ω
0.30
Ω
0.33
Ω
0.40
Ω
0.50
Ω
0.75
Ω
1.00
Ω
1.50
Ω
2.00
Ω
2.50
Ω
3.00
Ω
3.30
Ω
4.00
Ω
5.00
Ω
7.50
Ω
8.00
Ω
10.0
Ω
Tolerance CC2015FC ±1% Standard (except as noted).
Note 2: Thermal Resistance -
In High Power Applications where the circuit board
material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal
resistance of the chip resistor is useful to establish the maximum power capability of the
chip resistor in the application. The film temperature is measured at the center of the
resistor element and the solder pad temperature is measured at the center of the
termination pad (point X in the recommended circuit layouts shown below). Maximum
temperature of the chip resistor (at the center of chip) should not exceed 150°C through
the temperature range of the application
.
CC2520FC Standard Resistance Values:
0.010
Ω
0.015
Ω
0.020
Ω
0.025
Ω
0.030
Ω
5%
5%
5%
5%
5%
0.033
Ω
0.040
Ω
0.050
Ω
0.075
Ω
0.10
Ω
0.15
Ω
5%
5%
2%
2%
0.20
Ω
0.25
Ω
0.30
Ω
0.33
Ω
0.40
Ω
0.50
Ω
0.75
Ω
1.00
Ω
1.50
Ω
2.00
Ω
2.50
Ω
3.00
Ω
3.30
Ω
4.00
Ω
5.00
Ω
7.50
Ω
8.00
Ω
10.0
Ω
Tolerance CC2520FC ±1% Standard (except as noted).
Recommended Circuit Board Layout
(current and sense connections):
Fig. 1A:
Kelvin layout recom-
mended for values below 0.20Ω
C = Current connection
S = Sense connection
C
C
Custom resistance values and non-standard tolerances
can be manufactured for high quantity applications.
Please contact Caddock Applications Engineering.
X
S
S
X
Fig. 1B:
Kelvin layout
recommended for higher
resistance values.
C
X
X
C
C
S
S
Note: Actual width of current trace is based on magnitude of current. Point of connection should be in the area shown.
Applications Engineering
17271 North Umpqua Hwy.
Roseburg, Oregon 97470-9422
Phone: (541) 496-0700
Fax: (541) 496-0408
© 2004 Caddock Electronics, Inc.
CADDOCK
e-mail: caddock@caddock.com • web: www.caddock.com
For Caddock Distributors listed by country see caddock.com/contact/dist.html
Sales and Corporate Office
1717 Chicago Avenue
Riverside, California 92507-2364
Phone: (951) 788-1700
Fax: (951) 369-1151
28_IL106.1004
Type CC Low Resistance Precision Chip Resistors
Page 2 of 2
Style WB - Wire Bond Version
Resistance
Model
CC2015WB
CC2520WB
is a hybrid mountable version with metallized pads for wire bonding utilizing
aluminum wire
and
a metallized back surface for solder attachment of the back surface to a heat sinking substrate.
Dimensions in inches and (millimeters)
A
.200
±.007
(5.08
±.18)
.250
±.007
(6.35
±.18)
B
.150
±.007
(3.81
±.18)
.200
±.007
(5.08
±.18)
C
.027
±.003
(.69
±.08)
.027
±.003
(.69
±.08)
D
.050 min.
(1.27 min.)
.040 min.
(1.02 min.)
Aluminum wire to be used for bonding
Aluminum wire to be used for bonding
Power Capability Information
Thermal Resistance
R
θJC
Film (J) to Solder Pad (C)
(see note 3)
13.9°C/Watt
8.33°C/Watt
Max. Chip
Temperature
Comments
Min.
0.020
Ω
0.025
Ω
Max.
10.0
Ω
10.0
Ω
150°C
150°C
Note 3: Thermal Resistance -
In High Power Applications where the circuit board material
provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of
the chip resistor is useful to establish the maximum power capability of the chip resistor in the
application. The film temperature is measured at the center of the resistor element and the
solder pad temperature is measured at the soldered interface with the circuit board. Maximum
temperature of the chip resistor (at the center of chip) should not exceed 150°C through the
temperature range of the application.
CC2015WB Standard Resistance Values:
Tolerance CC2015WB ±1% Standard (except as noted).
0.020
Ω
0.025
Ω
0.030
Ω
0.033
Ω
0.040
Ω
5%
5%
5%
5%
5%
0.050
Ω
2%
0.075
Ω
2%
0.10
Ω
0.15
Ω
0.20
Ω
0.25
Ω
0.30
Ω
0.33
Ω
0.40
Ω
0.50
Ω
0.75
Ω
1.00
Ω
1.50
Ω
2.00
Ω
2.50
Ω
3.00
Ω
3.30
Ω
4.00
Ω
5.00
Ω
7.50
Ω
8.00
Ω
10.0
Ω
Location for Sense (Potential) Connection:
Sense connection shall be
made in the crosshatched
portion of the termination
pad.
Film Temperature
Measuring Point
Sense Wire
Current Wire
CC2520WB Standard Resistance Values:
0.025
Ω
0.030
Ω
0.033
Ω
0.040
Ω
5%
5%
5%
5%
0.050
Ω
2%
0.075
Ω
2%
0.10
Ω
0.15
Ω
0.20
Ω
0.25
Ω
0.30
Ω
0.33
Ω
0.40
Ω
0.50
Ω
0.75
Ω
1.00
Ω
1.50
Ω
2.00
Ω
2.50
Ω
3.00
Ω
3.30
Ω
4.00
Ω
5.00
Ω
7.50
Ω
8.00
Ω
10.0
Ω
Tolerance CC2520WB ±1% Standard (except as noted).
Sense Wire
Current Wire
Solder pad, soldered
interface with circuit board.
.055 (1.40) centered
Circuit board: IMS, Ceramic (Alumina) , or other.
WB Resistor mounting
Custom resistance values and non-standard tolerances
can be manufactured for high quantity applications.
Please contact Caddock Applications Engineering.
General Information for Type CC - Style FC and Style WB - Chip Resistors
Specifications:
Temperature Coefficient:
TC referenced to
+25°C,
ΔR
taken at +150°C.
0.50 ohm and above, -20 to +80 ppm/°C
0.050 ohm to 0.49 ohm, 0 to +200 ppm/°C
below 0.050 ohm, 0 to +300 ppm/°C.
Inductance:
Less than 5 nH typical.
Load Life:
1000 hours at rated power, based
upon 150°C max. chip temperature,
ΔR
± (0.5% + 0.0005 ohm).
Momentary Overload:
1.5 times rated power,
for 5 seconds,
ΔR
± (0.5% + 0.0005 ohm).
Operating Temperature:
-55°C to +150°C.
Measurement Note:
All measurements are
taken using Kelvin connections per the
recommended connection locations.
Solder attachment note:
Style FC
has a bare ceramic back surface.
The recommended solders for flip chip
solder attachment are 62Sn / 36Pb / 2Ag,
96.5Sn / 3.5Ag, or standard Sn / Ag / Cu
solder alloys.
Style WB
has a metallized back surface for
soldering to a substrate or a heat sink. The
recommended solders to be used are
62Sn / 36Pb / 2Ag, 96.5Sn / 3.5Ag, or
standard Sn / Ag / Cu solder alloys.
Packaging information:
Style FC,
flip chip resistors, are shipped with the bare
ceramic side up in the pocket, with the solderable pads fac-
ing down.
Style WB,
wire bondable resistors, are shipped with the
wire bondable pads facing up in the pocket.
The illustration shows the orientation of the CC1512 and
CC2015 chip resistors in the tape. The CC2520 chip resistors
are rotated 90° from what is shown in the illustration.
7” dia.
(178 mm)
12mm
0.473”
Bo
Ao
Ordering
Information:
Ko signifies tape thickness and dimension
Physical Size
1512 = 0.150” x 0.120”
2015 = 0.200” x 0.150”
2520 = 0.250” x 0.200”
Ao
Bo
Ko
.512” arbor hole
(13mm)
Size 1512
Size 2015
Size 2520
CC 2520 FC - 0.10 - 1%
Type CC
Style:
FC or WB
Resistor Value (Ω)
See charts for availability
Tolerance:
±
5% below 0.050Ω
±
2% 0.050Ω to 0.099Ω
±
1% 0.10Ω and above
0.135” (3.43mm)
0.189” (4.80mm) 0.271” (6.88mm)
0.167” (4.24mm) 0.209” (5.31mm) 0.216” (5.49mm)
0.037” (0.94mm) 0.087” (2.21mm) 0.066” (1.68mm)
A
D
C
B
Carrier Tape and pocket dimensions:
Tape is 12mm Carrier Tape (8mm pitch)
Full reel quantities:
1500 pieces per reel for CC1512
1000 pieces per reel for CC2015 and CC2520
Quantities of less than 250 will be shipped in tape without reel and
without tape leader at the option of Caddock.
Tape dimensions and materials will be consistent with EIA-481-1.
Reels will be marked with a label containing Caddock logo, part
number, resistor value, tolerance, packaging date, and quantity.
Dimensions in inches and (millimeters)
Applications Engineering
17271 North Umpqua Hwy.
Roseburg, Oregon 97470-9422
Phone: (541) 496-0700
Fax: (541) 496-0408
© 2004 Caddock Electronics, Inc.
CADDOCK
e-mail: caddock@caddock.com • web: www.caddock.com
For Caddock Distributors listed by country see caddock.com/contact/dist.html
Sales and Corporate Office
1717 Chicago Avenue
Riverside, California 92507-2364
Phone: (951) 788-1700
Fax: (951) 369-1151
28_IL106.1004
Automotive Electronics
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