T555403-DBN datasheet, PDF - EEWORLD Datasheet

T555403-DBN: DescriptionStandard R/W IDIC (264 Bit) with Integrated Capacitance; CategoryWireless rf/communication Telecom circuit; File Size733KB，27 Pages; ManufacturerAtmel (Microchip)

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T555403-DBN Overview

Standard R/W IDIC (264 Bit) with Integrated Capacitance

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Atmel (Microchip)
Parts packaging code	DIE
package instruction	DIE, DIE OR CHIP
Contacts	7
Reach Compliance Code	compli
JESD-30 code	R-XUUC-N7
Humidity sensitivity level	1
Number of functions	1
Number of terminals	7
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	DIE
Encapsulate equivalent code	DIE OR CHIP
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Peak Reflow Temperature (Celsius)	225
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	30
Base Number Matches	1

	T555403-DBN	T5554	T555401-DBN	T555402-DBN	T555401N-DDW	T555404-DBN
Description	Standard R/W IDIC (264 Bit) with Integrated Capacitance	Standard R/W IDIC (264 Bit) with Integrated Capacitance	Standard R/W IDIC (264 Bit) with Integrated Capacitance	Standard R/W IDIC (264 Bit) with Integrated Capacitance	Standard R/W IDIC (264 Bit) with Integrated Capacitance	Standard R/W IDIC (264 Bit) with Integrated Capacitance

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