256X8 SPI BUS SERIAL EEPROM, DSO8, 2 X 3 MM, MLP-8
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | SOIC |
| package instruction | 2 X 3 MM, MLP-8 |
| Contacts | 8 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum clock frequency (fCLK) | 10 MHz |
| Data retention time - minimum | 40 |
| Durability | 1000000 Write/Erase Cycles |
| JESD-30 code | R-XDSO-N8 |
| JESD-609 code | e0 |
| length | 3 mm |
| memory density | 2048 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 256 words |
| character code | 256 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 256X8 |
| Package body material | UNSPECIFIED |
| encapsulated code | VSON |
| Encapsulate equivalent code | SOLCC8,.11,20 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, VERY THIN PROFILE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.6 mm |
| Serial bus type | SPI |
| Maximum standby current | 0.000002 A |
| Maximum slew rate | 0.005 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 2 mm |
| Maximum write cycle time (tWC) | 5 ms |
| write protect | HARDWARE/SOFTWARE |
| Base Number Matches | 1 |
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