Am29F200B
Known Good Wafer
Data Sheet
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SUPPLEMENT
Am29F200B Known Good Wafer
2 Megabit (256 K x 8-Bit/128 K x 16-Bit)
CMOS 5.0 Volt-only, Boot Sector Flash Memory, Die Revision 1
Note:
This supplement contains information on the Am29F200B in Known Good Wafer form. Refer to the
Am29F200B standard datasheet (publication 21526) for full electrical specifications.
DISTINCTIVE CHARACTERISTICS
■
Top or bottom boot block configurations
available
■
Minimum 1,000,000 write cycle guarantee
per sector
■
20-year data retention at 125°C
■
Tested to datasheet specifications at
temperature
■
Quality and reliability levels equivalent to
standard packaged components
■
Complies with JEDEC standards for wafer
shipments
GENERAL DESCRIPTION
The Am29F200B in Known Good Wafer (KGW) form is
an 2 Mbit, 5.0 volt-only Flash memory. AMD defines
KGW as standard product in wafer form, tested for func-
tionality and speed. AMD KGW products have the same
reliability and quality as AMD products in packaged form.
Electrical Specifications
Refer to the Am29F200B data sheet, publication
number 21526, for full electrical specifications on the
Am29F200B in KGW form.
Publication#
30332
Rev:
A
Amendment/0
Issue Date:
April 22, 2003
S U P P L E M E N T
PRODUCT SELECTOR GUIDE
Family Part Number
Speed Option (V
CC
= 5.0 V
±
10%)
Max access time, ns (t
ACC
)
Max CE# access time, ns (t
CE
)
Max OE# access time, ns (t
OE
)
Am29F200B KGW
-55
(V
CC
= 5.0 V
±
-75
(V
CC
= 5.0 V
±
5%)
5%)
55
55
30
70
70
30
-90
90
90
35
-120
120
120
50
Note:
Refer to
“Test Conditions”
for additional information related to speed options.
DIE PHOTOGRAPH
DIE PAD LOCATIONS
9 8
10
11
12
7 6 5 4 3 2 1 42 41 40 39 38 37 36 35 34
33
32
31
Y
X
AMD logo location
13 14 15 16 17 18 19 20 21 22
23
24 25 26 27 28 29 30
2
Am29F200B Known Good Wafer
April 22, 2003
S U P P L E M E N T
PAD DESCRIPTION
Pad locations relative to V
CC
.
Pad
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
Signal
V
CC
DQ4
DQ12
DQ5
DQ13
DQ6
DQ14
DQ7
DQ15/A-1
V
SS
BYTE#
A16
A15
A14
A13
A12
A11
A10
A9
A8
WE#
RESET#
RY/BY#
A7
A6
A5
A4
A3
A2
A1
A0
CE#
V
SS
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
Pad Center (mils)
X
0.00
–6.80
–12.80
–18.60
–24.50
–30.30
–36.30
–42.10
–48.00
–55.70
–57.50
–57.50
–57.10
–51.30
–45.90
–40.00
–34.60
–28.80
–23.30
–17.40
–12.00
–2.40
9.50
30.30
35.80
41.60
47.00
52.90
58.30
64.10
64.50
64.50
64.50
55.00
47.40
41.50
35.60
29.70
23.90
18.00
12.10
6.20
Y
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
1.40
–6.50
–18.00
–124.90
–124.90
–124.90
–124.90
–124.90
–124.90
–124.60
–124.90
–124.90
–128.60
–128.60
–124.90
–124.90
–124.90
–124.90
–124.90
–124.90
–124.90
–18.00
–6.50
3.80
2.30
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
Pad Center (millimeters)
X
Y
0.0000
0.0000
–0.1727
0.0000
–0.3251
0.0000
–0.4724
0.0000
–0.6223
0.0000
–0.7696
0.0000
–0.9220
0.0000
–1.0693
0.0000
–1.2192
0.0000
–1.4148
0.0356
–1.4605
–0.1651
–1.4605
–0.4572
–1.4503
–3.1725
–1.3030
–3.1725
–1.1659
–3.1725
–1.0160
–3.1725
–0.8788
–3.1725
–0.7315
–3.1725
–0.5918
–3.1648
–0.4420
–3.1725
–0.3048
–3.1725
–0.0610
–3.2664
0.2413
–3.2664
0.7696
–3.1725
0.9093
–3.1725
1.0566
–3.1725
1.1938
–3.1725
1.3437
–3.1725
1.4808
–3.1725
1.6281
–3.1725
1.6383
–0.4572
1.6383
–0.1651
1.6383
0.0965
1.3970
0.0584
1.2040
0.0000
1.0541
0.0000
0.9042
0.0000
0.7544
0.0000
0.6071
0.0000
0.4572
0.0000
0.3073
0.0000
0.1575
0.0000
Note:
The coordinates above are relative to the die center and can be used to operate wire bonding equipment.
April 22, 2003
Am29F200B Known Good Wafer
3
S U P P L E M E N T
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
Am29F200B
T
-75
WJ
C
1
DIE REVISION
This number refers to the specific AMD manufacturing process and product
technology reflected in this document. It is entered in the revision field of AMD
standard product nomenclature.
TEMPERATURE RANGE
C
= Commercial (0°C to +70°C)
I
= Industrial (–40
°
C to +85
°
C)
E
= Extended (–55
°
C to +125
°
C)
Contact AMD for higher temperature range devices.
PACKAGE TYPE
WJ
= Wafer Jar (Contact factory for availability)
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
B
= Top sector
= Bottom sector
DEVICE NUMBER/DESCRIPTION
Am29F200B Known Good Wafer
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS Flash Memory
5.0 Volt-only Program and Erase
Valid Combinations
AM29F200BT-55,
AM29F200BB-55
(55 ns, V
CC
= 5.0 V ±5%)
AM29F200BT-75,
AM29F200BB-75
(70 ns, V
CC
= 5.0 V ±5%)
AM29F200BT-90,
AM29F200BB-90
AM29F200BT-120,
AM29F200BB-120
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
WJC1, WJI1, WJE1
4
Am29F200B Known Good Wafer
April 22, 2003
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