CY62157DV30L-55ZXIT datasheet, PDF

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CY62157DV30L-55ZXIT: DescriptionStandard SRAM, 512KX16, 55ns, CMOS, PDSO48, 12 X 18.40 MM, 1 MM HEIGHT, LEAD FREE, MO-142, TSOP1-48; Categorystorage storage; File Size2MB，12 Pages; ManufacturerCypress Semiconductor

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CY62157DV30L-55ZXIT Overview

Standard SRAM, 512KX16, 55ns, CMOS, PDSO48, 12 X 18.40 MM, 1 MM HEIGHT, LEAD FREE, MO-142, TSOP1-48

CY62157DV30L-55ZXIT Parametric

Parameter Name	Attribute value
Parts packaging code	TSOP1
package instruction	TSOP1,
Contacts	48
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	55 ns
JESD-30 code	R-PDSO-G48
JESD-609 code	e3
length	18.4 mm
memory density	8388608 bit
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of terminals	48
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.2 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
width	12 mm
Base Number Matches	1

CY62157DV30L-55ZXIT Related Products

	CY62157DV30L-55ZXIT	CY62157DV30LL-70BVIT	CY62157DV30LL-55ZSIT	CY62157DV30LL-70BVXIT	CY62157DV30LL-45ZSXIT	CY62157DV30L-55ZSXIT	CY62157DV30L-45BVIT
Description	Standard SRAM, 512KX16, 55ns, CMOS, PDSO48, 12 X 18.40 MM, 1 MM HEIGHT, LEAD FREE, MO-142, TSOP1-48	Standard SRAM, 512KX16, 70ns, CMOS, PBGA48, 6 X 8 MM, 1 MM HEIGHT, FBGA-48	Standard SRAM, 512KX16, 55ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 512KX16, 70ns, CMOS, PBGA48, 6 X 8 MM, 1 MM HEIGHT, LEAD FREE, FBGA-48	Standard SRAM, 512KX16, 45ns, CMOS, PDSO44, LEAD FREE, TSOP2-44	Standard SRAM, 512KX16, 55ns, CMOS, PDSO44, LEAD FREE, TSOP2-44	Standard SRAM, 512KX16, 45ns, CMOS, PBGA48, 6 X 8 MM, 1 MM HEIGHT, FBGA-48
Parts packaging code	TSOP1	BGA	TSOP2	BGA	TSOP2	TSOP2	BGA
package instruction	TSOP1,	VFBGA,	TSOP2,	VFBGA,	TSOP2,	TSOP2,	VFBGA,
Contacts	48	48	44	48	44	44	48
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	55 ns	70 ns	55 ns	70 ns	45 ns	55 ns	45 ns
JESD-30 code	R-PDSO-G48	R-PBGA-B48	R-PDSO-G44	R-PBGA-B48	R-PDSO-G44	R-PDSO-G44	R-PBGA-B48
length	18.4 mm	8 mm	18.415 mm	8 mm	18.415 mm	18.415 mm	8 mm
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1
Number of terminals	48	48	44	48	44	44	48
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	512KX16	512KX16	512KX16	512KX16	512KX16	512KX16	512KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	VFBGA	TSOP2	VFBGA	TSOP2	TSOP2	VFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1 mm	1.194 mm	1 mm	1.194 mm	1.194 mm	1 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.2 V	2.2 V	2.2 V	2.2 V	2.2 V	2.2 V	2.2 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	BALL	GULL WING	BALL	GULL WING	GULL WING	BALL
Terminal pitch	0.5 mm	0.75 mm	0.8 mm	0.75 mm	0.8 mm	0.8 mm	0.75 mm
Terminal location	DUAL	BOTTOM	DUAL	BOTTOM	DUAL	DUAL	BOTTOM
width	12 mm	6 mm	10.16 mm	6 mm	10.16 mm	10.16 mm	6 mm
JESD-609 code	e3	e0	e0	e1	e3/e4	e3/e4	-
Terminal surface	TIN	TIN LEAD	TIN LEAD	TIN SILVER COPPER	MATTE TIN/NICKEL PALLADIUM GOLD	MATTE TIN/NICKEL PALLADIUM GOLD	-
Maker	-	Cypress Semiconductor	-	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor

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