W27E01-70 datasheet, PDF - EEWORLD Datasheet

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W27E01-70: DescriptionEEPROM, 128KX8, 70ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32; Categorystorage storage; File Size248KB，15 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W27E01-70 Overview

EEPROM, 128KX8, 70ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

W27E01-70 Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP, DIP32,.6
Contacts	32
Reach Compliance Code	unknown
ECCN code	3A991.B.1.B.2
Maximum access time	70 ns
command user interface	NO
Data polling	NO
JESD-30 code	R-PDIP-T32
length	41.91 mm
memory density	1048576 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Programming voltage	12 V
Certification status	Not Qualified
Maximum seat height	5.33 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
switch bit	NO
width	15.24 mm
Base Number Matches	1

W27E01-70 Related Products

	W27E01-70	W27E01Q-70	W27E01-90	W27E01P-90
Description	EEPROM, 128KX8, 70ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	EEPROM, 128KX8, 70ns, Parallel, CMOS, PDSO32, 8 X 14 MM, STSOP-32	EEPROM, 128KX8, 90ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	EEPROM, 128KX8, 90ns, Parallel, CMOS, PQCC32, PLASTIC, LCC-32
Parts packaging code	DIP	TSOP	DIP	QFJ
package instruction	DIP, DIP32,.6	8 X 14 MM, STSOP-32	DIP, DIP32,.6	QCCJ, LDCC32,.5X.6
Contacts	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknow
ECCN code	3A991.B.1.B.2	3A991.B.1.B.2	EAR99	EAR99
Maximum access time	70 ns	70 ns	90 ns	90 ns
command user interface	NO	NO	NO	NO
Data polling	NO	NO	NO	NO
JESD-30 code	R-PDIP-T32	R-PDSO-G32	R-PDIP-T32	R-PQCC-J32
length	41.91 mm	12.4 mm	41.91 mm	13.97 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bi
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	128KX8	128KX8	128KX8	128KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	TSSOP	DIP	QCCJ
Encapsulate equivalent code	DIP32,.6	TSSOP32,.56,20	DIP32,.6	LDCC32,.5X.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V
Programming voltage	12 V	12 V	12 V	12 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.33 mm	1.2 mm	5.33 mm	3.56 mm
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA	0.03 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	J BEND
Terminal pitch	2.54 mm	0.5 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	QUAD
switch bit	NO	NO	NO	NO
width	15.24 mm	8 mm	15.24 mm	11.43 mm
Maker	-	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation

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