AM27C020-170PE datasheet, PDF - EEWORLD Datasheet

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AM27C020-170PE: DescriptionOTP ROM, 256KX8, 170ns, CMOS, PDIP32, PLASTIC, DIP-32; Categorystorage storage; File Size46KB，2 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM27C020-170PE Overview

OTP ROM, 256KX8, 170ns, CMOS, PDIP32, PLASTIC, DIP-32

AM27C020-170PE Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP,
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	170 ns
JESD-30 code	R-PDIP-T32
length	42.164 mm
memory density	2097152 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.715 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

AM27C020-170PE Related Products

	AM27C020-170PE	AM27C020-170JE	AM27C020-200PE	AM27C020-170PI	AM27C020-205PI	AM27C020-200JE	AM27C020-205JI	AM27C020-175PI	AM27C020-170JI	AM27C020-175JI
Description	OTP ROM, 256KX8, 170ns, CMOS, PDIP32, PLASTIC, DIP-32	OTP ROM, 256KX8, 170ns, CMOS, PQCC32, PLASTIC, LCC-32	OTP ROM, 256KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32	OTP ROM, 256KX8, 170ns, CMOS, PDIP32, PLASTIC, DIP-32	OTP ROM, 256KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32	OTP ROM, 256KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32	OTP ROM, 256KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32	OTP ROM, 256KX8, 170ns, CMOS, PDIP32, PLASTIC, DIP-32	OTP ROM, 256KX8, 170ns, CMOS, PQCC32, PLASTIC, LCC-32	OTP ROM, 256KX8, 170ns, CMOS, PQCC32, PLASTIC, LCC-32
Parts packaging code	DIP	QFJ	DIP	DIP	DIP	QFJ	QFJ	DIP	QFJ	QFJ
package instruction	DIP,	QCCJ,	DIP,	DIP,	DIP,	QCCJ,	QCCJ,	DIP,	QCCJ,	QCCJ,
Contacts	32	32	32	32	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	170 ns	170 ns	200 ns	170 ns	200 ns	200 ns	200 ns	170 ns	170 ns	170 ns
JESD-30 code	R-PDIP-T32	R-PQCC-J32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PQCC-J32	R-PQCC-J32	R-PDIP-T32	R-PQCC-J32	R-PQCC-J32
length	42.164 mm	13.97 mm	42.164 mm	42.164 mm	42.164 mm	13.97 mm	13.97 mm	42.164 mm	13.97 mm	13.97 mm
memory density	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32	32	32
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	85 °C	85 °C	125 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-40 °C	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	QCCJ	DIP	DIP	DIP	QCCJ	QCCJ	DIP	QCCJ	QCCJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.715 mm	3.556 mm	5.715 mm	5.715 mm	5.715 mm	3.556 mm	3.556 mm	5.715 mm	3.556 mm	3.556 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.25 V	5.5 V	5.25 V	5.25 V	5.5 V	5.25 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.75 V	4.5 V	4.75 V	4.75 V	4.5 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO	NO	YES	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	J BEND	J BEND
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	DUAL	QUAD	QUAD	DUAL	QUAD	QUAD
width	15.24 mm	11.43 mm	15.24 mm	15.24 mm	15.24 mm	11.43 mm	11.43 mm	15.24 mm	11.43 mm	11.43 mm
Maker	-	-	AMD	AMD	AMD	AMD	AMD	AMD	AMD	AMD

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