Bulletin I0129J rev. C 02/00
IR060LM06CS02CB
FAST RECOVERY DIODE
Junction Size:
Wafer Size:
V
RRM
Class:
Passivation Process:
Reference IR Packaged Part:
Square 60 x 60 mils
4"
600 V
Glassivated MOAT
Major Ratings and Characteristics
Parameters
V
FM
Maximum Forward Voltage
Units
1.3 V
600 V
55 ns
Test Conditions
T
J
= 25°C, I
F
= 2 A
T
J
= 25°C, I
RRM
= 10 µA
T
J
= 25°C, I
F
= 1A, -di/dt = 100A/µs
(1)
V
RRM
Reverse Breakdown Voltage
t
rr
Typical Reverse Recovery Time
(1)
Nitrogen flow on die edge.
Mechanical Characteristics
Nominal Back Metal Composition, Thickness
Nominal Front Metal Composition, Thickness
Chip Dimensions
Wafer Diameter
Wafer Thickness
Maximum Width of Sawing Line
Reject Ink Dot Size
Ink Dot Location
Recommended Storage Environment
Cr - Ni - Ag (1 KA - 4 KA - 6 KA)
100% Al, (5 µm)
60 x 60 mils (see drawing)
100 mm, with std. < 110 > flat
260 µm, ± 10 µm
45 µm
0.25 mm diameter minimum
See drawing
Storage in original container, in essicated
nitrogen, with no contamination
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1
IR060LM06CS02CB
Bulletin I0129J rev. C 02/00
Ordering Information Table
Device Code
IR
1
1
2
3
4
5
6
7
8
-
-
-
-
-
-
-
-
International Rectifier Device
Chip Dimension in Mils
060
2
L
3
M
4
06
5
C
6
S02
7
CB
8
Type of Device: L = Wire Bondable Fast Recovery Diode
Passivation Process: M = Glassivated MOAT
Voltage code: Code x 100 = V
RRM
Metallization: C = Aluminium (Anode) - Silver (Cathode)
t
rr
code6
CB
CF
= Probed Uncut Die (wafer in box)
= Inked Probed Sawn wafer on film (blue tape)
Outline Table
INK DOT WITH INDICATION SITE
1524 - 50 (60 - 2)
+ 15
1044 - 5
(41 + 0.59)
- 0.2
Ag
Al
+ 15
1044 - 5
(41 + 0.59 )
- 0.2
1524 - 50 (60 - 2)
5 TYP.
(0.2 typ.)
260
±
10
(10.23
±
0.39)
All dimensions are in microns (mils)
2
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