The EC1119 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 1 GHz, the EC1119 typically provides 14.8 dB
of gain, +36 dBm Output IP3, and +18.6 dBm P1dB.
Functional Diagram
GND
4
1
2
GND
3
RF OUT
Applications
•
•
•
•
•
•
Mobile Infrastructure
CATV / DBS
W-LAN / ISM
RFID
Defense / Homeland Security
Fixed Wireless
The EC1119 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation. The device is
ideal for wireless applications and is available in low-cost,
surface-mountable plastic SOT-86 and SOT-89 packages.
The EC1119 is also available in a lead-free/green/RoHS-
compliant SOT-89 package. All devices are 100% RF and
DC tested.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the EC1119 will work for other various applications within
the DC to 3.5 GHz frequency range such as CATV and
fixed wireless.
RF IN
EC1119B / EC1119B-G
GND
4
RF In
1
3
RF Out
2
GND
EC1119C
Specifications
(1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Output P1dB
Output IP3
(2)
Test Frequency
Gain
Large-signal Gain
(3)
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
(2)
Noise Figure
Device Voltage
Device Current
Typical Performance
(4)
Units
MHz
MHz
dB
dBm
dBm
MHz
dB
dB
dB
dB
dBm
dBm
dB
V
mA
Min
DC
Typ
1000
14.8
+18.6
+36
2000
13.5
13.2
20
24
+18.6
+33.2
5.5
4.8
80
Max
3500
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3
(2)
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
500
15
-32
-25.5
+19
+36
4.5
Typical
900
14.8
-22.5
-25
+18.6
+36
4.9
1900
13.8
-20
-25
+18.6
+33.2
5
2140
13
-19.5
-25
+18.5
+33
5.2
4. Test conditions: T = 25º C, Supply Voltage = +6 V, Device Voltage = +6V, R
bias
= 15
Ω,
50
Ω
System.
1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +6 V, Rbias = 15
Ω,
50
Ω
System.
2. 3OIP measured with two tones at an output power of +5 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Large-signal gain is tested with an input power level of +5.5 dBm.
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
Device Current
RF Input Power (continuous)
Junction Temperature
-40 to +85
°C
-55 to +150
°C
130 mA
+12 dBm
+250
°C
Ordering Information
Part No.
EC1119B
EC1119B-G
EC1119C
Rating
Description
InGaP HBT Gain Block
(lead-tin SOT-89 Pkg)
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
InGaP HBT Gain Block (SOT-86 Pkg)
Specifications and information are subject to change without notice
Operation of this device above any of these parameters may cause permanent damage.
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 1 of 7 April 2005
EC1119
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
The Communications Edge
TM
Product Information
InGaP HBT Gain Block
Typical Device RF Performance
Supply Bias = +6 V, R
bias
= 15
Ω,
I
cc
= 80 mA
MHz
dB
dB
dB
dBm
dBm
dB
100
15.2
-35
-25
+18.8
+36
4.4
500
15
-33
-25
+18.6
+36
4.6
900
15
-23
-25
+18.6
+36
4.8
1900
14
-20
-25
+18.6
+33.2
5.1
2140
13.5
-21
-25
+18.5
+32.9
5.2
2400
13.3
-21
-24
+18.5
+32.4
5.4
3500
12.4
-23
-20
+18.1
1. Test conditions: T = 25º C, Supply Voltage = +6 V, Device Voltage = 4.8 V, Rbias = 15.0
Ω,
Icc = 80 mA typical, 50
Ω
System.
2. 3OIP measured with two tones at an output power of +5 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Gain vs. Frequency
20
15
Gain (dB)
10
5
0
0
1
2
3
4
Frequency (GHz)
OIP3 vs. Frequency
40
35
OIP3 (dBm)
30
25
25°C
20
500
1000
85°C
-40°C
2500
3000
2
500
6
5
4
3
5
6
-5
-15
-25
-35
-45
0
1
S11, S22 vs. Frequency
200
S22
Icc (mA)
160
120
25°C
80
40
0
2
3
4
Frequency (GHz)
5
6
0
1
Icc vs. Vcc
S11, S22 (dB)
S11
2
3
Vcc (V)
4
5
6
Noise Figure vs. Frequency
24
22
P1dB (dBm)
NF (dB)
20
18
16
14
P1dB vs. Frequency
25°C
1000
1500
Frequency (MHz)
2000
12
500
1000
85°C
-40°C
2500
3000
1500
2000
Frequency (MHz)
1500
2000
Frequency (MHz)
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 2 of 7 April 2005
EC1119
The Communications Edge
TM
Product Information
InGaP HBT Gain Block
Recommended Application Circuit
Vcc
Icc = 80 mA
R4
Bias
Resistor
C4
Bypass
Capacitor
C3
0.018 µF
L1
RF Choke
RF IN
EC1119
C1
Blocking
Capacitor
C2
Blocking
Capacitor
RF OUT
EC1119B-PCB
EC1119C-PCB
Reference
Designator
L1
C1, C2, C4
50
820 nH
.018 µF
Recommended Component Values
Frequency (MHz)
500
900
1900
2200
220 nH
68 nH
27 nH
22 nH
1000 pF
100 pF
68 pF
68 pF
2500
18 nH
56 pF
3500
15 nH
39 pF
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig.
L1
C1, C2
C3
C4
R4
Value / Type
39 nH wirewound inductor
56 pF chip capacitor
0.018
μF
chip capacitor
Do Not Place
15.0
Ω
1% tolerance
Size
0603
0603
0603
0805
Recommended Bias Resistor Values
Supply
R1 value
Size
Voltage
6V
15.0 ohms
0805
7V
27.5 ohms
1210
8V
40 ohms
1210
9V
53 ohms
2010
10 V
65 ohms
2010
12 V
90 ohms
2512
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +6 V. A
1% tolerance resistor is recommended.
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 3 of 7 April 2005
EC1119
The Communications Edge
TM
Product Information
InGaP HBT Gain Block
EC1119B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The component will be marked with an
“1119” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235° C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
Land Pattern
1. Ground / thermal vias are critical for the proper performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 4 of 7 April 2005
EC1119
The Communications Edge
TM
Product Information
InGaP HBT Gain Block
EC1119B-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded
(maximum 245°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The component will be marked with an
“1119G” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260° C convection reflow
Standard:
JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
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