UPD98421F1-GA1-A datasheet, PDF

UPD98421F1-GA1-A: DescriptionContent Addressable SRAM, 8KX64, MOS, PBGA240, 16 X 16 MM, PLASTIC, FBGA-240; Categorystorage storage; File Size326KB，44 Pages; ManufacturerNEC Electronics

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UPD98421F1-GA1-A Overview

Content Addressable SRAM, 8KX64, MOS, PBGA240, 16 X 16 MM, PLASTIC, FBGA-240

Parameter Name	Attribute value
Parts packaging code	BGA
package instruction	LFBGA,
Contacts	240
Reach Compliance Code	unknown
ECCN code	EAR99
JESD-30 code	S-PBGA-B240
JESD-609 code	e1
length	16 mm
memory density	524288 bit
Memory IC Type	CONTENT ADDRESSABLE SRAM
memory width	64
Number of functions	1
Number of terminals	240
word count	8192 words
character code	8000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX64
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.46 mm
Maximum supply voltage (Vsup)	3.45 V
Minimum supply voltage (Vsup)	3.15 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	MOS
Temperature level	COMMERCIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	16 mm
Base Number Matches	1

	UPD98421F1-GA1-A	UPD98421F1-GA1
Description	Content Addressable SRAM, 8KX64, MOS, PBGA240, 16 X 16 MM, PLASTIC, FBGA-240	Content Addressable SRAM, 8KX64, MOS, PBGA240, 16 X 16 MM, PLASTIC, FBGA-240
Parts packaging code	BGA	BGA
package instruction	LFBGA,	LFBGA,
Contacts	240	240
Reach Compliance Code	unknown	compliant
ECCN code	EAR99	EAR99
JESD-30 code	S-PBGA-B240	S-PBGA-B240
JESD-609 code	e1	e0
length	16 mm	16 mm
memory density	524288 bit	524288 bit
Memory IC Type	CONTENT ADDRESSABLE SRAM	CONTENT ADDRESSABLE SRAM
memory width	64	64
Number of functions	1	1
Number of terminals	240	240
word count	8192 words	8192 words
character code	8000	8000
Operating mode	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	8KX64	8KX64
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.46 mm	1.46 mm
Maximum supply voltage (Vsup)	3.45 V	3.45 V
Minimum supply voltage (Vsup)	3.15 V	3.15 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V
surface mount	YES	YES
technology	MOS	MOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	TIN SILVER COPPER	TIN LEAD
Terminal form	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	16 mm	16 mm

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