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The realization of vehicle autonomous driving is inseparable from the "eyes" that can see the surrounding environment. The vehicle-mounted millimeter-wave radar is such a "smart eye". It can not on...[Details]
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You must have heard of AMD's processors or graphics cards, but have you ever heard of AMD bicycles? Recently, a store called Amdfanstore sold two AMD bicycles. Although they are not manufactured by...[Details]
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Foreign media MSPoweruser reported that in 2020, the launch of the second generation of iPhone SE was very popular, but the biggest problem of last year's iPhone SE 2 was the 4.7-inch display, which ...[Details]
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What is a combination oscilloscope?
A combination oscilloscope combines a high-performance analog oscilloscope with a digital oscilloscope and can easily switch from one operating mode to another....[Details]
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Introduction
With the increasing automation, complexity, accuracy and reliability of measurement and control systems, people are demanding higher and higher performance from sensors. Currently,...[Details]
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D7001 and D7002 sets are solutions for decorative products such as LED light strips and guardrail tubes. Compared with traditional products, this solution has many advantages such as high performance,...[Details]
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Currently, more and more automotive, industrial and other applications are emphasizing functional safety, and their development process also requires advanced and complete tool chain support, as well...[Details]
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When there are many buttons in the keyboard of the single-chip computer system, in order to reduce the occupation of the I/O port, the buttons are often arranged in a matrix form, as shown in Figure ...[Details]
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include "timescale.v"
// synopsys translate_on
`include "can_defines.v"
module can_top
(
`ifdef CAN_WISHBONE_IF
wb_clk_i,
wb_rst_i,
wb_dat_i,
wb_dat...[Details]
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Benefiting from the expansion wave caused by the global shortage of semiconductor production capacity, Japanese semiconductor equipment giant Tokyo Electron (TEL) raised its financial forecast, with ...[Details]
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According to news on March 13, Reuters said that Samsung Electronics will use the MR-MUF (mass reflow molded underfill) chip packaging process led by competitor SK Hynix instead of the non-conductive...[Details]
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The rich on-chip device modules and configurable fuse options are one of the advantages of AVR over the older generation of MCUs. However, after the advent of STM8S, this advantage of AVR has lost som...[Details]
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With the rapid development of artificial intelligence (AI) applications, visual AI has become the main battlefield for various technology companies. Based on machine learning, visual AI devices at ...[Details]
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As AI applications continue to scale and large language models (LLMs) become commoditized, developers are increasingly tasked with packaging artificial intelligence (AI) and machine learning (ML) mod...[Details]
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As the "central brain" of smart cars, the performance ceiling of smart driving chips will directly determine the upper limit of a car's intelligent driving level.
In the early days, the ...[Details]
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