DDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184
Parameter Name | Attribute value |
Parts packaging code | DIMM |
package instruction | DIMM, |
Contacts | 184 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FOUR BANK PAGE BURST |
Maximum access time | 0.75 ns |
Other features | AUTO/SELF REFRESH |
JESD-30 code | R-XDMA-N184 |
memory density | 4831838208 bit |
Memory IC Type | DDR DRAM MODULE |
memory width | 72 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 184 |
word count | 67108864 words |
character code | 64000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64MX72 |
Package body material | UNSPECIFIED |
encapsulated code | DIMM |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Certification status | Not Qualified |
self refresh | YES |
Maximum supply voltage (Vsup) | 2.7 V |
Minimum supply voltage (Vsup) | 2.3 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal location | DUAL |
Base Number Matches | 1 |
M383L6420FUS-CA2 | M383L2828FU1-CB0 | M383L2828FU1-CA2 | M312L6420FUS-CB0 | M383L6420FUS-CB0 | M312L2828FU0-CA2 | M312L2828FU0-CB0 | M312L6420FUS-CA2 | |
---|---|---|---|---|---|---|---|---|
Description | DDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184 | DDR DRAM Module, 128MX72, 0.75ns, CMOS, DIMM-184 | DDR DRAM Module, 128MX72, 0.75ns, CMOS, DIMM-184 | DDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184 | DDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184 | DDR DRAM Module, 128MX72, 0.75ns, CMOS, DIMM-184 | DDR DRAM Module, 128MX72, 0.75ns, CMOS, DIMM-184 | DDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184 |
Parts packaging code | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
package instruction | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, |
Contacts | 184 | 184 | 184 | 184 | 184 | 184 | 184 | 184 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | compliant | compliant | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
access mode | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
Maximum access time | 0.75 ns | 0.75 ns | 0.75 ns | 0.75 ns | 0.75 ns | 0.75 ns | 0.75 ns | 0.75 ns |
Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 code | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 |
memory density | 4831838208 bit | 9663676416 bit | 9663676416 bit | 4831838208 bit | 4831838208 bit | 9663676416 bit | 9663676416 bit | 4831838208 bit |
Memory IC Type | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE |
memory width | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 184 | 184 | 184 | 184 | 184 | 184 | 184 | 184 |
word count | 67108864 words | 134217728 words | 134217728 words | 67108864 words | 67108864 words | 134217728 words | 134217728 words | 67108864 words |
character code | 64000000 | 128000000 | 128000000 | 64000000 | 64000000 | 128000000 | 128000000 | 64000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 64MX72 | 128MX72 | 128MX72 | 64MX72 | 64MX72 | 128MX72 | 128MX72 | 64MX72 |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
self refresh | YES | YES | YES | YES | YES | YES | YES | YES |
Maximum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
Minimum supply voltage (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
Nominal supply voltage (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maker | - | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG |