HC/UH SERIES, DUAL 4-INPUT AND GATE, PQCC20, PLASTIC, CC-20
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | QFN |
package instruction | PLASTIC, CC-20 |
Contacts | 20 |
Reach Compliance Code | not_compliant |
series | HC/UH |
JESD-30 code | S-PQCC-J20 |
JESD-609 code | e0 |
length | 8.9662 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | AND GATE |
MaximumI(ol) | 0.004 A |
Number of functions | 2 |
Number of entries | 4 |
Number of terminals | 20 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC20,.4SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 2/6 V |
Prop。Delay @ Nom-Sup | 28 ns |
propagation delay (tpd) | 28 ns |
Certification status | Not Qualified |
Schmitt trigger | NO |
Maximum seat height | 4.57 mm |
Maximum supply voltage (Vsup) | 6 V |
Minimum supply voltage (Vsup) | 2 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 8.9662 mm |
Base Number Matches | 1 |
M74HC21C1 | M74HC21F1 | M74HC21M1 | M74HC21B1N | M54HC21F1 | |
---|---|---|---|---|---|
Description | HC/UH SERIES, DUAL 4-INPUT AND GATE, PQCC20, PLASTIC, CC-20 | HC/UH SERIES, DUAL 4-INPUT AND GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14 | HC/UH SERIES, DUAL 4-INPUT AND GATE, PDSO14, MICRO, PLASTIC, GULLWING, DIP-14 | HC/UH SERIES, DUAL 4-INPUT AND GATE, PDIP14, PLASTIC, DIP-14 | HC/UH SERIES, DUAL 4-INPUT AND GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | QFN | DIP | SOIC | DIP | DIP |
package instruction | PLASTIC, CC-20 | FRIT SEALED, CERAMIC, DIP-14 | SOP, SOP14,.25 | DIP, DIP14,.3 | DIP, DIP14,.3 |
Contacts | 20 | 14 | 14 | 14 | 14 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
series | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
JESD-30 code | S-PQCC-J20 | R-GDIP-T14 | R-PDSO-G14 | R-PDIP-T14 | R-GDIP-T14 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
MaximumI(ol) | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
Number of functions | 2 | 2 | 2 | 2 | 2 |
Number of entries | 4 | 4 | 4 | 4 | 4 |
Number of terminals | 20 | 14 | 14 | 14 | 14 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C |
Package body material | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
encapsulated code | QCCJ | DIP | SOP | DIP | DIP |
Encapsulate equivalent code | LDCC20,.4SQ | DIP14,.3 | SOP14,.25 | DIP14,.3 | DIP14,.3 |
Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
Prop。Delay @ Nom-Sup | 28 ns | 28 ns | 28 ns | 28 ns | 33 ns |
propagation delay (tpd) | 28 ns | 28 ns | 28 ns | 28 ns | 33 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Schmitt trigger | NO | NO | NO | NO | NO |
Maximum seat height | 4.57 mm | 5 mm | 1.75 mm | 5.1 mm | 5 mm |
Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V |
Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | YES | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | QUAD | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 8.9662 mm | 7.62 mm | 3.9 mm | 7.62 mm | 7.62 mm |
Base Number Matches | 1 | 1 | 1 | 1 | - |