Standard SRAM, 16KX1, 85ns, CMOS, CQCC20
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | QCCN, LCC20,.3X.43 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 85 ns |
I/O type | SEPARATE |
JESD-30 code | R-CQCC-N20 |
JESD-609 code | e0 |
memory density | 16384 bit |
Memory IC Type | STANDARD SRAM |
memory width | 1 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 20 |
word count | 16384 words |
character code | 16000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 16KX1 |
Output characteristics | 3-STATE |
Exportable | NO |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | QCCN |
Encapsulate equivalent code | LCC20,.3X.43 |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.00002 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.104 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Base Number Matches | 1 |
HM4-65262-9 | HM4-65262B-9 | HM4-65262C-9 | HM1-65262C-9 | |
---|---|---|---|---|
Description | Standard SRAM, 16KX1, 85ns, CMOS, CQCC20 | Standard SRAM, 16KX1, 70ns, CMOS, CQCC20 | Standard SRAM, 16KX1, 85ns, CMOS, CQCC20 | Standard SRAM, 16KX1, 85ns, CMOS, CDIP20 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
package instruction | QCCN, LCC20,.3X.43 | QCCN, LCC20,.3X.43 | QCCN, LCC20,.3X.43 | DIP, DIP20,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 85 ns | 70 ns | 85 ns | 85 ns |
I/O type | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
JESD-30 code | R-CQCC-N20 | R-CQCC-N20 | R-CQCC-N20 | R-GDIP-T20 |
JESD-609 code | e0 | e0 | e0 | e0 |
memory density | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 1 | 1 | 1 | 1 |
Number of functions | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 |
Number of terminals | 20 | 20 | 20 | 20 |
word count | 16384 words | 16384 words | 16384 words | 16384 words |
character code | 16000 | 16000 | 16000 | 16000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
organize | 16KX1 | 16KX1 | 16KX1 | 16KX1 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Exportable | NO | NO | NO | NO |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
encapsulated code | QCCN | QCCN | QCCN | DIP |
Encapsulate equivalent code | LCC20,.3X.43 | LCC20,.3X.43 | LCC20,.3X.43 | DIP20,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum standby current | 0.00002 A | 0.00002 A | 0.0004 A | 0.0004 A |
Minimum standby current | 2 V | 2 V | 2 V | 2 V |
Maximum slew rate | 0.104 mA | 0.116 mA | 0.104 mA | 0.104 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
Terminal location | QUAD | QUAD | QUAD | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 |