OT PLD, 17ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Parts packaging code | QLCC |
package instruction | QCCJ, LDCC28,.5SQ |
Contacts | 28 |
Reach Compliance Code | compliant |
Other features | MACROCELLS INTERCONNECTED BY GLOBAL BUS; 16 MACROCELLS; 2 EXTERNAL CLOCKS |
Architecture | PAL-TYPE |
maximum clock frequency | 71.4 MHz |
JESD-30 code | S-PQCC-J28 |
JESD-609 code | e0 |
length | 11.5062 mm |
Dedicated input times | 4 |
Number of I/O lines | 16 |
Number of entries | 20 |
Output times | 16 |
Number of product terms | 160 |
Number of terminals | 28 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4 DEDICATED INPUTS, 16 I/O |
Output function | MACROCELL |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC28,.5SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | 220 |
power supply | 5 V |
Programmable logic type | OT PLD |
propagation delay | 17 ns |
Certification status | Not Qualified |
Maximum seat height | 4.572 mm |
Maximum supply voltage | 5.25 V |
Minimum supply voltage | 4.75 V |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 11.5062 mm |
Base Number Matches | 1 |
EP630LC-15 | EP630LC-20 | EP630LI-20 | EP630PC-15 | EP630PC-20 | EP630PI-20 | EP630SC-15 | EP630SC-20 | EP630SI-20 | |
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Description | OT PLD, 17ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28 | OT PLD, 22ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28 | OT PLD, 22ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28 | OT PLD, 17ns, PAL-Type, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | OT PLD, 22ns, PAL-Type, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | OT PLD, 22ns, PAL-Type, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | OT PLD, 17ns, PAL-Type, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24 | OT PLD, 22ns, PAL-Type, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24 | OT PLD, 22ns, PAL-Type, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | QLCC | QLCC | QLCC | DIP | DIP | DIP | SOIC | SOIC | SOIC |
package instruction | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | SOP, SOP24,.4 | SOP, SOP24,.4 | SOP, SOP24,.4 |
Contacts | 28 | 28 | 28 | 24 | 24 | 24 | 24 | 24 | 24 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
Other features | MACROCELLS INTERCONNECTED BY GLOBAL BUS; 16 MACROCELLS; 2 EXTERNAL CLOCKS | MACROCELLS INTERCONNECTED BY GLOBAL BUS; 16 MACROCELLS; 2 EXTERNAL CLOCKS | MACROCELLS INTERCONNECTED BY GLOBAL BUS; 16 MACROCELLS; 2 EXTERNAL CLOCKS | MACROCELLS INTERCONNECTED BY GLOBAL BUS; 16 MACROCELLS; 2 EXTERNAL CLOCKS | MACROCELLS INTERCONNECTED BY GLOBAL BUS; 16 MACROCELLS; 2 EXTERNAL CLOCKS | MACROCELLS INTERCONNECTED BY GLOBAL BUS; 16 MACROCELLS; 2 EXTERNAL CLOCKS | MACROCELLS INTERCONNECTED BY GLOBAL BUS; 16 MACROCELLS; 2 EXTERNAL CLOCKS | MACROCELLS INTERCONNECTED BY GLOBAL BUS; 16 MACROCELLS; 2 EXTERNAL CLOCKS | MACROCELLS INTERCONNECTED BY GLOBAL BUS; 16 MACROCELLS; 2 EXTERNAL CLOCKS |
Architecture | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
maximum clock frequency | 71.4 MHz | 55.5 MHz | 55.5 MHz | 71.4 MHz | 55.5 MHz | 55.5 MHz | 71.4 MHz | 55.5 MHz | 55.5 MHz |
JESD-30 code | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 11.5062 mm | 11.5062 mm | 11.5062 mm | 31.6865 mm | 31.6865 mm | 31.6865 mm | 15.4 mm | 15.4 mm | 15.4 mm |
Dedicated input times | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
Number of I/O lines | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Number of entries | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Output times | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Number of product terms | 160 | 160 | 160 | 160 | 160 | 160 | 160 | 160 | 160 |
Number of terminals | 28 | 28 | 28 | 24 | 24 | 24 | 24 | 24 | 24 |
Maximum operating temperature | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C |
organize | 4 DEDICATED INPUTS, 16 I/O | 4 DEDICATED INPUTS, 16 I/O | 4 DEDICATED INPUTS, 16 I/O | 4 DEDICATED INPUTS, 16 I/O | 4 DEDICATED INPUTS, 16 I/O | 4 DEDICATED INPUTS, 16 I/O | 4 DEDICATED INPUTS, 16 I/O | 4 DEDICATED INPUTS, 16 I/O | 4 DEDICATED INPUTS, 16 I/O |
Output function | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCJ | QCCJ | QCCJ | DIP | DIP | DIP | SOP | SOP | SOP |
Encapsulate equivalent code | LDCC28,.5SQ | LDCC28,.5SQ | LDCC28,.5SQ | DIP24,.3 | DIP24,.3 | DIP24,.3 | SOP24,.4 | SOP24,.4 | SOP24,.4 |
Package shape | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 220 | 220 | 220 | NOT SPECIFIED | NOT SPECIFIED | 220 | 220 | 220 | 220 |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Programmable logic type | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
propagation delay | 17 ns | 22 ns | 22 ns | 17 ns | 22 ns | 22 ns | 17 ns | 22 ns | 22 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 4.572 mm | 4.572 mm | 4.572 mm | 4.318 mm | 4.318 mm | 4.318 mm | 2.65 mm | 2.65 mm | 2.65 mm |
Maximum supply voltage | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V |
Minimum supply voltage | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | NO | NO | NO | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 11.5062 mm | 11.5062 mm | 11.5062 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.5 mm | 7.5 mm | 7.5 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |