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MPC8360TZUALFGA

Description
PowerQUICC⑩ II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
File Size1MB,112 Pages
ManufacturerFREESCALE (NXP)
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MPC8360TZUALFGA Overview

PowerQUICC⑩ II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

Freescale Semiconductor
Technical Data
Document Number: MPC8360EEC
Rev. 2, 12/2007
MPC8360E/MPC8358E
PowerQUICC™ II Pro Processor
Revision 2.x TBGA Silicon
Hardware Specifications
This document provides an overview of the MPC8360E/58E
PowerQUICC
II Pro processor revision 2.x TBGA
features, including a block diagram showing the major
functional components. This device is a cost-effective,
highly integrated communications processor that addresses
the needs of the networking, wireless infrastructure and
telecommunications markets. Target applications include
next generation DSLAMs, network interface cards for 3G
basestations (Node Bs), routers, media gateways and high
end IADs. The device extends current PowerQUICC II Pro
offerings, adding higher CPU performance, additional
functionality, faster interfaces and robust interworking
between protocols while addressing the requirements related
to time-to-market, price, power, and package size. This
device can be used for the control plane along with data
plane functionality.
For functional characteristics of the processor, refer to the
MPC8360E Integrated Communications Processor Family
Reference Manual, Rev. 2.
To locate any published errata or updates for this document,
contact your Freescale sales office.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . 8
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 13
Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 15
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 16
DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 19
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
UCC Ethernet Controller: Three-Speed Ethernet, MII
Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
I
2
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
TDM/SI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
UTOPIA/POS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
HDLC, BISYNC, Transparent, and Synchronous
UART. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . . 68
Clocking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
System Design Information . . . . . . . . . . . . . . . . . . . 104
Document Revision History. . . . . . . . . . . . . . . . . . . 108
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 108
© Freescale Semiconductor, Inc., 2007. All rights reserved.
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