MT57W1MH18BF-4 datasheet, PDF - EEWORLD Datasheet

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MT57W1MH18BF-4: Description1MX18 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165; Categorystorage storage; File Size1MB，28 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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MT57W1MH18BF-4 Overview

1MX18 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165

MT57W1MH18BF-4 Parametric

Parameter Name	Attribute value
Maker	Rochester Electronics
Parts packaging code	BGA
package instruction	13 X 15 MM, 1 MM PITCH, FBGA-165
Contacts	165
Reach Compliance Code	unknown
Is Samacsys	N
Maximum access time	0.45 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165
JESD-609 code	e1
length	15 mm
memory density	18874368 bit
Memory IC Type	DDR SRAM
memory width	18
Number of functions	1
Number of terminals	165
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX18
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
Parallel/Serial	PARALLEL
Certification status	COMMERCIAL
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	13 mm
Base Number Matches	1

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MT57W1MH18BF-4 Related Products

	MT57W1MH18BF-4	MT57W1MH18BF-6	MT57W1MH18BF-7.5	MT57W2MH8BF-7.5	MT57W512H36BF-7.5
Description	1MX18 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165	1MX18 DDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165	1MX18 DDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165	2MX8 DDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165	512KX36 DDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
Parts packaging code	BGA	BGA	BGA	BGA	BGA
package instruction	13 X 15 MM, 1 MM PITCH, FBGA-165	TBGA,	13 X 15 MM, 1 MM PITCH, FBGA-165	13 X 15 MM, 1 MM PITCH, FBGA-165	13 X 15 MM, 1 MM PITCH, FBGA-165
Contacts	165	165	165	165	165
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
Maximum access time	0.45 ns	0.5 ns	0.5 ns	0.5 ns	0.5 ns
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165
JESD-609 code	e1	e1	e1	e1	e1
length	15 mm	15 mm	15 mm	15 mm	15 mm
memory density	18874368 bit	18874368 bit	18874368 bit	16777216 bit	18874368 bit
Memory IC Type	DDR SRAM	DDR SRAM	DDR SRAM	DDR SRAM	DDR SRAM
memory width	18	18	18	8	36
Number of functions	1	1	1	1	1
Number of terminals	165	165	165	165	165
word count	1048576 words	1048576 words	1048576 words	2097152 words	524288 words
character code	1000000	1000000	1000000	2000000	512000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
organize	1MX18	1MX18	1MX18	2MX8	512KX36
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TBGA	TBGA	TBGA	TBGA	TBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER
Terminal form	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	13 mm	13 mm	13 mm	13 mm	13 mm

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