BX80552651T2 datasheet, PDF - EEWORLD Datasheet

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BX80552651T2: DescriptionMicroprocessor, 32-Bit, 3400MHz, CMOS, PBGA775, FLIP CHIP, LGA-775; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，108 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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BX80552651T2 Overview

Microprocessor, 32-Bit, 3400MHz, CMOS, PBGA775, FLIP CHIP, LGA-775

BX80552651T2 Parametric

Parameter Name	Attribute value
Maker	Intel
Parts packaging code	LGA
package instruction	LGA,
Contacts	775
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Is Samacsys	N
Address bus width	36
bit size	32
boundary scan	YES
maximum clock frequency	200 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-PBGA-N775
length	37.5 mm
low power mode	YES
Number of terminals	775
Package body material	PLASTIC/EPOXY
encapsulated code	LGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
Maximum seat height	4.15 mm
speed	3400 MHz
Maximum supply voltage	1.3 V
Minimum supply voltage	1.2 V
surface mount	YES
technology	CMOS
Terminal form	NO LEAD
Terminal location	BOTTOM
width	37.5 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR
Base Number Matches	1

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Intel

Pentium

4 Processor 6x1

Sequence

Datasheet

– On 65 nm Process in the 775-land LGA Package and supporting

Intel

Extended Memory 64 Technology

January 2006

Document Number: 310308-001

Contents

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS

ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES

RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER

INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING

APPLICATIONS.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel

Pentium

4 Processor 6x1 sequence may contain design defects or errors known as errata which may cause the product to deviate from

published specifications.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel

Extended Memory 64 Technology (Intel

EM64T) requires a computer system with a processor, chipset, BIOS, operating system, device drivers

and applications enabled for Intel EM64T. Processor will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS. Performance

will vary depending on your hardware and software configurations. See www.intel.com/info/em64t for more information including details on which

processors support EM64T or consult with your system vendor for more information.

Hyper-Threading Technology requires a computer system with an Intel

Pentium

4 processor supporting HT Technology and a HT Technology

enabled chipset, BIOS, and an operating system. Performance will vary depending on the specific hardware and software you use. See <http://

www.intel.com/info/hyperthreading> for information.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system.

Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

Intel, Pentium, Intel NetBurst Intel SpeedStep, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the

United States and other countries.

*Other names and brands may be claimed as the property of others.

Datasheet

Contents

Introduction

............................................................................................................................. 13

1.1

1.2

Terminology ........................................................................................................................ 14

1.1.1 Processor Packaging Terminology ........................................................................ 14

References ......................................................................................................................... 15

Power and Ground Lands................................................................................................... 17

Decoupling Guidelines........................................................................................................ 17

2.2.1 V

Decoupling ..................................................................................................... 17

2.2.2 V

Decoupling ...................................................................................................... 17

2.2.3 FSB Decoupling ..................................................................................................... 18

Voltage Identification .......................................................................................................... 18

Reserved, Unused, and TESTHI Signals ........................................................................... 20

Voltage and Current Specification ...................................................................................... 21

2.5.1 Absolute Maximum and Minimum Ratings............................................................. 21

2.5.2 DC Voltage and Current Specification ................................................................... 22

2.5.3 V

Overshoot....................................................................................................... 26

2.5.4 Die Voltage Validation ........................................................................................... 26

Signaling Specifications...................................................................................................... 27

2.6.1 FSB Signal Groups ................................................................................................ 27

2.6.2 GTL+ Asynchronous Signals ................................................................................. 29

2.6.3 Processor DC Specifications ................................................................................. 30

2.6.3.1 GTL+ Front Side Bus Specifications ...................................................... 33

Clock Specifications............................................................................................................ 34

2.7.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking .................................. 34

2.7.2 FSB Frequency Select Signals (BSEL[2:0])........................................................... 35

2.7.3 Phase Lock Loop (PLL) and Filter ......................................................................... 35

2.7.4 BCLK[1:0] Specifications ....................................................................................... 37

Package Mechanical Drawing ............................................................................................ 39

Processor Component Keep-Out Zones............................................................................. 43

Package Loading Specifications......................................................................................... 43

Package Handling Guidelines............................................................................................. 43

Package Insertion Specifications........................................................................................ 44

Processor Mass Specification............................................................................................. 44

Processor Materials ............................................................................................................ 44

Processor Markings ............................................................................................................ 44

Processor Land Coordinates ..............................................................................................45

Processor Land Assignments ............................................................................................. 47

Alphabetical Signals Reference .......................................................................................... 70

Processor Thermal Specifications ...................................................................................... 79

5.1.1 Thermal Specifications .......................................................................................... 79

Electrical Specifications

..................................................................................................... 17

2.1

2.2

2.3

2.4

2.5

2.6

2.7

Package Mechanical Specifications

.............................................................................. 39

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

Land Listing and Signal Descriptions

........................................................................... 47

4.1

4.2

Thermal Specifications and Design Considerations

.............................................. 79

5.1

Datasheet

Contents

5.2

5.1.2 Thermal Metrology................................................................................................. 82

Processor Thermal Features .............................................................................................. 82

5.2.1 Thermal Monitor..................................................................................................... 82

5.2.2 Thermal Monitor 2.................................................................................................. 83

5.2.3 On-Demand Mode ................................................................................................. 84

5.2.4 PROCHOT# Signal................................................................................................ 85

5.2.5 THERMTRIP# Signal............................................................................................. 85

5.2.6 T

CONTROL

and Fan Speed Reduction.................................................................... 85

5.2.7 Thermal Diode ....................................................................................................... 85

Power-On Configuration Options........................................................................................ 89

Clock Control and Low Power States ................................................................................. 90

6.2.1 Normal State.......................................................................................................... 90

6.2.2 HALT and Enhanced HALT Powerdown States .................................................... 90

6.2.2.1 HALT Powerdown State......................................................................... 91

6.2.2.2 Enhanced HALT Powerdown State ....................................................... 91

6.2.3 Stop Grant State .................................................................................................... 92

6.2.4 Enhanced HALT Snoop or HALT Snoop State,

Stop Grant Snoop State......................................................................................... 92

6.2.4.1 HALT Snoop State, Stop Grant Snoop State......................................... 92

6.2.4.2 Enhanced HALT Snoop State................................................................ 92

Mechanical Specifications .................................................................................................. 93

7.1.1 Boxed Processor Cooling Solution Dimensions .................................................... 93

7.1.2 Boxed Processor Fan Heatsink Weight ................................................................. 95

7.1.3 Boxed Processor Retention Mechanism and Heatsink

Attach Clip Assembly............................................................................................. 95

Electrical Requirements...................................................................................................... 95

7.2.1 Fan Heatsink Power Supply .................................................................................. 95

Thermal Specifications ....................................................................................................... 97

7.3.1 Boxed Processor Cooling Requirements............................................................... 97

Mechanical Specifications ................................................................................................ 100

8.1.1 Balanced Technology Extended (BTX) Type I and

Type II Boxed Processor Cooling Solution Dimensions ...................................... 100

8.1.2 Boxed Processor Thermal Module Assembly Weight.......................................... 102

8.1.3 Boxed Processor Support and Retention Module (SRM) .................................... 102

Electrical Requirements.................................................................................................... 103

8.2.1 Thermal Module Assembly Power Supply ........................................................... 103

Thermal Specifications ..................................................................................................... 105

8.3.1 Boxed Processor Cooling Requirements............................................................. 105

8.3.2 Variable Speed Fan ............................................................................................. 106

Logic Analyzer Interface (LAI) .......................................................................................... 109

9.1.1 Mechanical Considerations.................................................................................. 109

9.1.2 Electrical Considerations ..................................................................................... 109

Features

..................................................................................................................................... 89

6.1

6.2

Boxed Processor Specifications

..................................................................................... 93

7.1

7.2

7.3

Balanced Technology Extended (BTX) Boxed Processor Specifications

..... 99

8.1

8.2

8.3

Debug Tools Specifications

............................................................................................ 109

9.1

Datasheet

Contents

Figures

2-1

2-2

2-3

3-1

3-2

3-3

3-4

3-5

3-6

4-1

4-2

5-1

5-2

5-3

6-1

7-1

7-2

7-3

7-4

7-5

7-6

7-7

7-8

8-1

8-2

8-3

8-4

8-5

8-6

8-7

8-8

Static and Transient Tolerance for 775_VR_CONFIG_05A Processors............................. 25

Overshoot Example Waveform ........................................................................................... 26

Phase Lock Loop (PLL) Filter Requirements.............................................................................. 36

Processor Package Assembly Sketch ........................................................................................ 39

Processor Package Drawing Sheet 1 of 3 .................................................................................. 40

Processor Package Drawing Sheet 2 of 3 .................................................................................. 41

Processor Package Drawing Sheet 3 of 3 .................................................................................. 42

Processor Top-Side Markings Example ..................................................................................... 44

Processor Land Coordinates and Quadrants (Top View) ........................................................... 45

land-out Diagram (Top View – Left Side).................................................................................... 48

land-out Diagram (Top View – Right Side) ................................................................................. 49

Thermal Profile for Processors with PRB = 0 ............................................................................. 81

Case Temperature (TC) Measurement Location ........................................................................ 82

Thermal Monitor 2 Frequency and Voltage Ordering .................................................................84

Processor Low Power State Machine......................................................................................... 90

Mechanical Representation of the Boxed Processor.................................................................. 93

Space Requirements for the Boxed Processor (Side View; applies to all four side views) ........ 94

Space Requirements for the Boxed Processor (Top View) ........................................................ 94

Space Requirements for the Boxed Processor (Overall View) ................................................... 95

Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 96

Baseboard Power Header Placement Relative to Processor Socket ......................................... 97

Boxed Processor Fan Heatsink Airspace Keep-out Requirements

(Side 1 View) .............................................................................................................................. 98

Boxed Processor Fan Heatsink Airspace Keep-out Requirements

(Side 2 View) .............................................................................................................................. 98

Mechanical Representation of the Boxed Processor with a Type I TMA.................................... 99

Mechanical Representation of the Boxed Processor with a Type II TMA.................................100

Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes ........101

Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume .........102

Assembly Stack Including the Support and Retention Module .................................................103

Boxed Processor TMA Power Cable Connector Description....................................................104

Balanced Technology Extended (BTX) Mainboard Power Header Placement (Hatched Area)105

Boxed Processor TMA Set Points ............................................................................................106

Datasheet

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