Dual-Port SRAM, 8KX9, 12ns, CMOS, PQCC68, PLASTIC, LCC-68
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | LCC |
package instruction | QCCJ, |
Contacts | 68 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Is Samacsys | N |
Maximum access time | 12 ns |
Other features | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN |
JESD-30 code | S-PQCC-J68 |
JESD-609 code | e3 |
length | 24.2062 mm |
memory density | 73728 bit |
Memory IC Type | DUAL-PORT SRAM |
memory width | 9 |
Number of functions | 1 |
Number of terminals | 68 |
word count | 8192 words |
character code | 8000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8KX9 |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 4.57 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | MATTE TIN |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 24.2062 mm |
Base Number Matches | 1 |