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MX29F022NBQC-12

Description
2M-BIT[256K x 8]CMOS FLASH MEMORY
Categorystorage    storage   
File Size602KB,46 Pages
ManufacturerMacronix
Websitehttp://www.macronix.com/en-us/Pages/default.aspx
Download Datasheet Parametric View All

MX29F022NBQC-12 Overview

2M-BIT[256K x 8]CMOS FLASH MEMORY

MX29F022NBQC-12 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMacronix
Parts packaging codeQFJ
package instructionQCCJ, LDCC32,.5X.6
Contacts32
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time120 ns
startup blockBOTTOM
command user interfaceYES
Data pollingYES
Durability100000 Write/Erase Cycles
JESD-30 codeR-PQCC-J32
JESD-609 codee0
length14.0462 mm
memory density2097152 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size1,2,1,3
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX8
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height3.55 mm
Department size16K,8K,32K,64K
Maximum standby current0.000005 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width11.5062 mm
MX29F022/022NT/B
2M-BIT[256K x 8]CMOS FLASH MEMORY
FEATURES
262,144x 8 only
Fast access time: 55/70/90/120ns
Low power consumption
- 30mA maximum active current
- 1uA typical standby current@5MHz
Programming and erasing voltage 5V±10%
Command register architecture
- Byte Programming (7us typical)
- Sector Erase (16K-Byte x1, 8K-Byte x 2, 32K-Byte
x1, and 64K-Byte x 3)
Auto Erase (chip & sector) and Auto Program
- Automatically erase any combination of sectors or
the whole chip with Erase Suspend capability.
- Automatically programs and verifies data at speci-
fied address
Erase Suspend/Erase Resume
- Suspends an erase operation to read data from, or
program data to, a sector that is not being erased,
then resumes the erase operation.
Status Reply
- Data polling & Toggle bit for detection of program
and erase cycle completion.
Chip protect/unprotect for 5V only system or 5V/12V
system
100,000 minimum erase/program cycles
Latch-up protected to 100mA from -1 to VCC+1V
Boot Code Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
Hardware RESET pin
- Resets internal state machine to read mode
Low VCC write inhibit is equal to or less than 3.2V
Package type:
- 32-pin PDIP
- 32-pin PLCC
- 32-pin TSOP (Type 1)
20 years data retention
GENERAL DESCRIPTION
The MX29F022T/B is a 2-mega bit Flash memory
organized as 256K bytes of 8 bits only. MXIC's Flash
memories offer the most cost-effective and reliable read/
write non-volatile random access memory. The
MX29F022T/B is packaged in 32-pin PDIP, PLCC and
32-pin TSOP(I). It is designed to be reprogrammed and
erased in-system or in-standard EPROM programmers.
The standard MX29F022T/B offers access time as fast
as 55ns, allowing operation of high-speed microproces-
sors without wait states. To eliminate bus contention,
the MX29F022T/B has separate chip enable (CE) and
output enable (OE) controls.
MXIC's Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
MX29F022T/B uses a command register to manage this
functionality. The command register allows for 100%
TTL level control inputs and fixed power supply levels
during erase and programming, while maintaining
maximum EPROM compatibility.
MXIC's Flash technology reliably stores memory
contents even after 100,000 erase and program cycles.
The MXIC cell is designed to optimize the erase and
programming mechanisms. In addition, the combina-
tion of advanced tunnel oxide processing and low
internal electric fields for erase and programming
operations produces reliable cycling. The MX29F022T/
B uses a 5.0V
±
10% VCC supply to perform the High
Reliability Erase and auto Program/Erase algorithms.
The highest degree of latch-up protection is achieved
with MXIC's proprietary non-epi process. Latch-up
protection is proved for stresses up to 100 milliamps on
address and data pin from -1V to VCC + 1V.
P/N:PM0556
REV. 1.3, NOV. 11, 2002
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