64K-bit CMOS EPROM(8K x 8)
| 27C64A | 27C64A-15FA | 27C64A-90A | 27C64AA12A | 27C64AA20FA | 27C64AI12FA | 27C64AI12N | |
|---|---|---|---|---|---|---|---|
| Description | 64K-bit CMOS EPROM(8K x 8) | 64K-bit CMOS EPROM(8K x 8) | 64K-bit CMOS EPROM(8K x 8) | 64K-bit CMOS EPROM(8K x 8) | 64K-bit CMOS EPROM(8K x 8) | 64K-bit CMOS EPROM(8K x 8) | 64K-bit CMOS EPROM(8K x 8) |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | - | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | - | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | - | 150 ns | 90 ns | 120 ns | 200 ns | 120 ns | 120 ns |
| I/O type | - | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | - | R-XDIP-T28 | R-PQCC-J32 | R-PQCC-J32 | R-XDIP-T28 | R-XDIP-T28 | R-PDIP-T28 |
| JESD-609 code | - | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | - | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| memory width | - | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | - | 28 | 32 | 32 | 28 | 28 | 28 |
| word count | - | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| character code | - | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Maximum operating temperature | - | 70 °C | 70 °C | 125 °C | 125 °C | 85 °C | 85 °C |
| Minimum operating temperature | - | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | - | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| Output characteristics | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | - | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | - | DIP | QCCJ | QCCJ | DIP | DIP | DIP |
| Encapsulate equivalent code | - | DIP28,.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE |
| power supply | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programming voltage | - | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | - | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| Maximum slew rate | - | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | NO | YES | YES | NO | NO | NO |
| technology | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | COMMERCIAL | COMMERCIAL | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | - | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | - | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL |
Analogue and Mixed Signal
Test/Measurement
Wireless Connectivity
RF/Wirelessly
Analog electronics
stm32/stm8
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