|
27C64A-90A |
27C64A |
27C64A-15FA |
27C64AA12A |
27C64AA20FA |
27C64AI12FA |
27C64AI12N |
Description |
64K-bit CMOS EPROM(8K x 8) |
64K-bit CMOS EPROM(8K x 8) |
64K-bit CMOS EPROM(8K x 8) |
64K-bit CMOS EPROM(8K x 8) |
64K-bit CMOS EPROM(8K x 8) |
64K-bit CMOS EPROM(8K x 8) |
64K-bit CMOS EPROM(8K x 8) |
Is it Rohs certified? |
incompatible |
- |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
Maker |
Philips Semiconductors (NXP Semiconductors N.V.) |
- |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
package instruction |
QCCJ, LDCC32,.5X.6 |
- |
DIP, DIP28,.6 |
QCCJ, LDCC32,.5X.6 |
DIP, DIP28,.6 |
DIP, DIP28,.6 |
DIP, DIP28,.6 |
Reach Compliance Code |
unknown |
- |
unknown |
unknown |
unknown |
unknown |
unknown |
Maximum access time |
90 ns |
- |
150 ns |
120 ns |
200 ns |
120 ns |
120 ns |
I/O type |
COMMON |
- |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
JESD-30 code |
R-PQCC-J32 |
- |
R-XDIP-T28 |
R-PQCC-J32 |
R-XDIP-T28 |
R-XDIP-T28 |
R-PDIP-T28 |
JESD-609 code |
e0 |
- |
e0 |
e0 |
e0 |
e0 |
e0 |
memory density |
65536 bit |
- |
65536 bit |
65536 bit |
65536 bit |
65536 bit |
65536 bit |
memory width |
8 |
- |
8 |
8 |
8 |
8 |
8 |
Number of terminals |
32 |
- |
28 |
32 |
28 |
28 |
28 |
word count |
8192 words |
- |
8192 words |
8192 words |
8192 words |
8192 words |
8192 words |
character code |
8000 |
- |
8000 |
8000 |
8000 |
8000 |
8000 |
Maximum operating temperature |
70 °C |
- |
70 °C |
125 °C |
125 °C |
85 °C |
85 °C |
Minimum operating temperature |
- |
- |
- |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
organize |
8KX8 |
- |
8KX8 |
8KX8 |
8KX8 |
8KX8 |
8KX8 |
Output characteristics |
3-STATE |
- |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
- |
CERAMIC |
PLASTIC/EPOXY |
CERAMIC |
CERAMIC |
PLASTIC/EPOXY |
encapsulated code |
QCCJ |
- |
DIP |
QCCJ |
DIP |
DIP |
DIP |
Encapsulate equivalent code |
LDCC32,.5X.6 |
- |
DIP28,.6 |
LDCC32,.5X.6 |
DIP28,.6 |
DIP28,.6 |
DIP28,.6 |
Package shape |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
CHIP CARRIER |
- |
IN-LINE |
CHIP CARRIER |
IN-LINE |
IN-LINE |
IN-LINE |
power supply |
5 V |
- |
5 V |
5 V |
5 V |
5 V |
5 V |
Programming voltage |
12.5 V |
- |
12.5 V |
12.5 V |
12.5 V |
12.5 V |
12.5 V |
Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum standby current |
0.0001 A |
- |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
Maximum slew rate |
0.03 mA |
- |
0.03 mA |
0.03 mA |
0.03 mA |
0.03 mA |
0.03 mA |
Nominal supply voltage (Vsup) |
5 V |
- |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
- |
NO |
YES |
NO |
NO |
NO |
technology |
CMOS |
- |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
- |
COMMERCIAL |
AUTOMOTIVE |
AUTOMOTIVE |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
J BEND |
- |
THROUGH-HOLE |
J BEND |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
Terminal pitch |
1.27 mm |
- |
2.54 mm |
1.27 mm |
2.54 mm |
2.54 mm |
2.54 mm |
Terminal location |
QUAD |
- |
DUAL |
QUAD |
DUAL |
DUAL |
DUAL |