EEWORLDEEWORLDEEWORLD

Part Number

Search

MQ1N3044UR-1

Description
Zener Diode, 100V V(Z), 20%, 1.25W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, LEADLESS, GLASS, MELF-2
CategoryDiscrete semiconductor    diode   
File Size161KB,3 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

MQ1N3044UR-1 Overview

Zener Diode, 100V V(Z), 20%, 1.25W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, LEADLESS, GLASS, MELF-2

MQ1N3044UR-1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeDO-213AB
package instructionO-LELF-R2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Is SamacsysN
Other featuresMETALLURGICALLY BONDED, HIGH RELIABILITY
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-213AB
JESD-30 codeO-LELF-R2
JESD-609 codee0
Number of components1
Number of terminals2
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation1.25 W
Certification statusNot Qualified
Nominal reference voltage100 V
surface mountYES
technologyZENER
Terminal surfaceTIN LEAD
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance20%
Working test current2.5 mA
Base Number Matches1
1N3016BUR-1 thru 1N3051BUR-1, e3
(or MLL3016B thru MLL3051B, e3)
SCOTTSDALE DIVISION
Surface Mount 1.5 W
GLASS ZENER DIODES
DESCRIPTION
This surface mountable zener diode series is similar to the 1N3016 thru
1N3051 JEDEC registration in the DO-13 package except that it meets the
surface mount DO-213AB outline. It is an ideal selection for applications of
high density and low parasitic requirements. Due to its glass hermetic seal
qualities and metallurgically enhanced internal construction, it is also well
suited for high-reliability applications. This can be acquired by a source
control drawing (SCD), or by ordering device types with MQ, MX, or MV
prefix to part number for equivalent screening to JAN, JANTX or JANTXV.
APPEARANCE
WWW .
Microsemi
.C
OM
DO-213AB
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
FEATURES
Leadless surface mount package equivalents to the
JEDEC registered 1N3016 thru 1N3051 except with
higher power rating of 1.5 Watts
Ideal for high-density mounting
Voltage range: 6.8 to 200 volts
Hermetically sealed, double-slug glass construction
Metallurgically enhanced contact construction.
Options for screening in accordance with MIL-PRF-
19500/115 for JAN, JANTX, JANTXV, and JANS with
MQ, MX, MV, or MSP prefixes respectively for part
numbers, e.g. MX1N3016BUR-1, MV1N3051BUR-1,
etc.
Axial lead “thru-hole” DO-13 packages per JEDEC
registration available as 1N3016B thru 1N3051B (see
separate data sheet with MIL-PRF-19500/115
qualification)
RoHS Compliant devices available by adding “e3” suffix
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Wide selection from 6.8 to 200 V
Tight voltage tolerances available
Low reverse (leakage) currents
Leadless package for surface mounting
Ideal for high-density mounting
Metallurgically enhanced internal contact design for
greater reliability and lower thermal resistance
Nonsensitive to ESD
Hermetically sealed glass package
Specified capacitance (see Figure 2)
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
Power dissipation at 25
º
C: 1.5 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to
+175
º
C
Thermal Resistance: 40
º
C/W junction to end cap,
º
or 120 C/W junction to ambient when mounted on
FR4 PC board (1 oz Cu) with recommended
footprint (see last page)
Steady-State Power: 1.50 watts at end-cap
temperature T
EC
< 115
o
C, or 1.25 watts at T
A
= 25
º
C
when mounted on FR4 PC board and
recommended footprint as described for thermal
resistance (also see Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
º
Solder Temperatures: 260 C for 10 s (max)
MECHANICAL AND PACKAGING
CASE: Hermetically sealed glass MELF package
TERMINALS: Tin-lead or RoHS compliant
annealed matte-Tin plating solderable per MIL-
STD-750, method 2026
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
MARKING: Cathode band only
TAPE & REEL optional: Standard per EIA-481-1-A
with 12 mm tape, 1500 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
WEIGHT: 0.05 grams
See package dimensions on last page
1N3016BUR-1, e3 thru
1N3051BUR-1, e3
Copyright
©
2006
3-12-2006 REV D
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
Does anyone have a good thermostat switch?
[i=s]This post was last edited by Alex1126 on 2019-5-16 16:19[/i] I have selected a temperature switch and would like to ask if anyone has used a similar product. The operating temperature of the temp...
Alex1126 Test/Measurement
Ultra-low power MCU-How to reduce the power consumption of MCU
[size=4] Low power consumption is a very important indicator of MCU. For example, some wearable devices have limited power. If the power consumed by the entire circuit is particularly large, the power...
fish001 Microcontroller MCU
[MM32 eMiniBoard Review] Part 4: Questions about multi-channel ADC
1. Introduction This time I originally wanted to use ADC and send serial port data to the host computer, but I found that the official routine had already implemented it, so there was no point in writ...
w494143467 Domestic Chip Exchange
Modbus_RTU (RS485) Fieldbus Remote Inputs/Outputs Modules System Design Based on GD32E231
Detailed document Source code PCB schematics and proofing files https://lceda.cn/editor#id=|2757f12a27324aebac45ee8b3f120693|f2b5d7b53466488fa332b206a804c7ed|53e5f75b74e64987a75c6cf6a065912c|65f4d1c27...
boming GD32 MCU
Particle Xenon nRF52840 BLE Development Board
The Particle Xenon is a Mesh BLE enabled development board based on the Nordic nRF52840, a BLE Cortex M4 with lots of flash, RAM and peripherals, and USB capabilities. [list] [*]Nordic Semiconductor n...
dcexpert DIY/Open Source Hardware
COCOFLY Tutorial - Crazy Shell Drone Series · Quick Start · [6] Use and Introduction of Ground Station Host Computer
[i=s]This post was last edited by Xiaokeke on 2020-4-2 10:01[/i]Use and introduction of ground station host computer Use and introduction of ground station host computer The COCOFLY ground station hos...
小壳壳 Analogue and Mixed Signal

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号