OP21B223K101LG datasheet, PDF - EEWORLD Datasheet

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OP21B223K101LG: DescriptionCeramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.022uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT; CategoryPassive components capacitor; File Size539KB，10 Pages; ManufacturerWalsin Technology Corporation; Environmental Compliance

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OP21B223K101LG Overview

Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.022uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT

OP21B223K101LG Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Objectid	1247814361
package instruction	, 0805
Reach Compliance Code	compliant
ECCN code	EAR99
capacitance	0.022 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
JESD-609 code	e3
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	10%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
method of packing	TR, PAPER, 13 INCH
positive tolerance	10%
Rated (DC) voltage (URdc)	100 V
size code	0805
surface mount	YES
Temperature characteristic code	X7R
Temperature Coefficient	15% ppm/°C
Terminal surface	Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND

OP21B223K101LG Preview

Approval sheet

Open Mode Series

MULTILAYER CERAMIC CAPACITORS

Open-Mode Series (100V to 500V)

0805 to 1812 Sizes

X7R Dielectric

RoHS Compliance

*Contents in this sheet are subject to change without prior notice.

Page 1 of 10

ASC_ Open Mode_012K_AS

Apr. 2011

Approval sheet

Open Mode Series

1. INTRODUCTION

WTC open-mode series MLCC is designed by a special internal electrode pattern, which can reduce voltage

concentrations by distributing voltage gradients throughout the entire capacitor. This special design also affords

open-mode pattern to prevent circuit leakage when focused to failure in a board flex situation.

2. FEATURES

b.

c.

d.

High voltage in a given case size.

Circuit open during product cracking.

High stability and reliability.

3. APPLICATIONS

a.

b.

c.

High current applications.

Power supply and related industries

The other mechanical stress concerned products.

4. HOW TO ORDER

OP

Series

OP=Open-mode

32

Size

21=0805

(2012)

31=1206

(3216)

32=1210

(3225)

43=1812

(4532)

B

Dielectric

B=X7R

103

Capacitance

K

Tolerance

201

Rated voltage

C

Termination

T

Packaging

T=7”

reeled

G=13”

reeled

Two significant

K=±10%

digits followed

M=±20%

by no. of zeros.

And R is in

place of

decimal point.

eg.:

102=10x10

2

=1000pF

Two significant

L=Ag/Ni/Sn

digits followed by

C=Cu/Ni/Sn

no. of zeros. And (Note 1)

R is in place of

decimal point.

101=100

VDC

201=200

VDC

251=250

VDC

501=500

VDC

Note 1: Please see below product range to find right termination code.

Page 2 of 10

ASC_ Open Mode_012K_AS

Apr. 2011

Approval sheet

Open Mode Series

5. EXTERNAL DIMENSIONS

Size

Inch (mm)

0805 (2012)

L (mm)

2.00±0.15

W (mm)

1.25±0.10

T (mm)/Symbol

0.80±0.10

1.25±0.10

0.80±0.10

0.95±0.10

1.25±0.10

1.60±0.20

0.95±0.10

1.25±0.10

1.60±0.20

2.50±0.30

1.25±0.10

2.00±0.20

B

D

B

C

D

G

C

D

G

M

D

K

Remark

M

B

(mm)

0.40±0.20

L

#

T

1206 (3216)

3.20±0.15

3.20±0.20

3.20±0.30

1.60±0.15

1.60±0.20

2.50±0.20

2.50±0.30

3.20±0.30

1210 (3225)

3.20±0.40

1812 (4532)

4.50+0.5/-0.3

#

0.50±0.20

M

B

M

B

W

Fig. 1 The outline of MLCC

0.50±0.25

0.60±0.25

# Reflow soldering only is recommended.

6. GENERAL ELECTRICAL DATA

Dielectric

Size

Capacitance*

Capacitance tolerance**

Rated voltage (WVDC)

Tan

δ*

Insulation resistance at Ur

Dielectric strength

Operating temperature

Capacitance characteristic

Termination

X7R

0805, 1206, 1210, 1812

100pF to 1µF

K (±10%), M (±20%)

100V, 200V, 250V, 500V

≤2.5%

≥10G

or RxC≥500 -F whichever is smaller

100V:

≥2.5

x WVDC

200V and 250V:

≥2

x WVDC

500V:

≥1.5

x WVDC

-55 to +125°

C

±15%

Ni/Sn (lead-free termination)

* Measured at 25° ambient temperature and 30~70% r elated humidity. Apply 1.0±0.2Vrms, 1.0kHz±10%.

C

** Preconditioning for Class II MLCC: Perform a heat treatment at 150±10° for 1 hour, then leave in a mbient condition for 24±2 hours

C

before measurement.

Page 3 of 10

ASC_ Open Mode_012K_AS

Apr. 2011

Approval sheet

Open Mode Series

7. CAPACITANCE RANGE

DIELECTRIC

SIZE

RATED VOLTAGE (VDC) 100

100pF (101)

B

120pF (121)

B

150pF (151)

B

180pF (181)

B

220pF (221)

B

270pF (271)

B

330pF (331)

B

390pF (391)

B

470pF (471)

B

560pF (561)

B

680pF (681)

B

820pF (821)

B

1,000pF (102)

B

1,200pF (122)

B

1,500pF (152)

B

1,800pF (182)

B

2,200pF (222)

B

2,700pF (272)

B

3,300pF (332)

B

3,900pF (392)

B

4,700pF (472)

B

5,600pF (562)

B

6,800pF (682)

B

8,200pF (822)

B

0.010µF (103)

B

0.012µF (123)

B

0.015µF (153)

B

0.018µF (183)

B

0.022µF (223)

B

0.027µF (273)

D

0.033µF (333)

D

0.039µF (393)

D

0.047µF (473)

D

0.056µF (563)

0.068µF (683)

0.082µF (823)

0.10µF (104)

0.12µF (124)

0.15µF (154)

0.18µF (184)

0.22µF (224)

0.27µF (274)

0.33µF (334)

0.39µF (394)

0.47µF (474)

0.56µF (564)

0.68µF (684)

0.82µF (824)

1.0µF (105)

Capacitance

X7R

0805

200 250

B

D

500

B^

100

1206

200 250

500

100

1210

200 250

500

100

1812

200 250

500

B

D

G

D

G

D

G

D

G

C

D

G

M

C

D

G

M

C

D

G

M

D

G

D

K

D

K

D

K

D

K

1. The letter in cell is expressed the symbol of product thickness.

2. The letter in cell with “^” mark is expressed product with Ag/Ni/Sn terminations.

Page 4 of 10

ASC_ Open Mode_012K_AS

Apr. 2011

Approval sheet

Open Mode Series

8. PACKAGING DIMENSION AND QUANTITY

Size

0805

Thickness (mm)/Symbol

0.80±0.10

1.25±0.10

0.80±0.10

1206

0.95±0.10

1.25±0.10

1.60±0.20

0.95±0.10

1210

1.25±0.10

1.60±0.20

2.50±0.30

1812

1.25±0.10

2.00±0.20

B

D

B

C

D

G

C

D

G

M

D

K

Paper tape

7” reel

4k

-

4k

-

13” reel

15k

-

15k

-

7” reel

-

3k

-

3k

2k

3k

2k

1k

Plastic tape

13” reel

-

10k

-

10k

-

Unit: pieces

9. INNER CONSTRUCTION OF OPEN-MODE DESIGN

M

B

CP

M

B

Crack

Fig. 2 Normal design (CP<M

B

) –

circuit leakage during cracking.

Fig. 3 Open-mode design (CP>M

B

) –

circuit open during cracking.

Fig. 4 Floating design (one kind of

open-mode design)– circuit open

during cracking.

Page 5 of 10

ASC_ Open Mode_012K_AS

Apr. 2011

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