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WS128K32V-20G2UM

Description
SRAM Module, 128KX32, 20ns, CMOS, CQFP68, 22.40 X 22.40 MM, CERAMIC, QFP-68
Categorystorage    storage   
File Size462KB,8 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
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WS128K32V-20G2UM Overview

SRAM Module, 128KX32, 20ns, CMOS, CQFP68, 22.40 X 22.40 MM, CERAMIC, QFP-68

WS128K32V-20G2UM Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeQFP
package instruction22.40 X 22.40 MM, CERAMIC, QFP-68
Contacts68
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time20 ns
Other featuresALSO CONFIGURABLE AS 512K X 8
Spare memory width16
JESD-30 codeS-CQFP-G68
JESD-609 codee4
length22.36 mm
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height3.51 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width22.36 mm
White Electronic Designs
128Kx32 3.3V SRAM MODULE
FEATURES
Access Times of 15**, 17, 20, 25, 35ns
MIL-STD-883 Compliant Devices Available
Low Voltage Operation
Packaging
• 66-pin, PGA Type, 1.075 inch square Hermetic
Ceramic HIP (Package 400)
• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880
inch) square (Package 510), 3.56mm (0.140 inch)
high.
Organized as 128Kx32; User Configurable as
256Kx16 or 512Kx8
Commercial, Industrial and Military Temperature
Ranges
WS128K32V-XXX
3.3 Volt Power Supply
Low Power CMOS
TTL Compatible Inputs and Outputs
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight
WS128K32V-XG2UX - 8 grams typical
WS128K32NV-XH1X - 13 grams typical
* This product is subject to change without notice.
** Commercial and Industrial only.
FIGURE 1 – PIN CONFIGURATION FOR WS128K32NV-XH1X
Top View
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
NC
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
#
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
NC
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
#
WE
4
#
I/O
27
A
3
A
4
A
5
WE
3
#
CS
3
#
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
66
8
WE
1
# CS
1
#
Pin Description
56
I/O
0-31
A
0-16
WE
1-4
#
CS
1-4
#
OE#
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
Block Diagram
WE
2
# CS
2
#
WE
3
# CS
3
#
WE
4
# CS
4
#
OE#
A
0-16
128K x 8
128K x 8
128K x 8
128K x 8
8
8
8
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
March 2006
Rev. 8
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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