Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, SODIMM-144
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Micron Technology |
Parts packaging code | MODULE |
package instruction | DIMM, |
Contacts | 144 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Is Samacsys | N |
access mode | SINGLE BANK PAGE BURST |
Maximum access time | 5.4 ns |
Other features | AUTO/SELF REFRESH |
JESD-30 code | R-XDMA-N144 |
JESD-609 code | e0 |
memory density | 1073741824 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE |
memory width | 64 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 144 |
word count | 16777216 words |
character code | 16000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 65 °C |
Minimum operating temperature | |
organize | 16MX64 |
Package body material | UNSPECIFIED |
encapsulated code | DIMM |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | 235 |
Certification status | Not Qualified |
self refresh | YES |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
Base Number Matches | 1 |
MT4LSDT1664HG-133XX | QFN23200DKAGHWS | MT4LSDT464HG-10EXX | MT4LSDT864HG-10EXX | MT4LSDT864HG-13EXX | MT4LSDT864HY-133XX | MT4LSDT864LHG-133XX | |
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Description | Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, SODIMM-144 | Fixed Resistor, Thin Film, 0.025W, 2320ohm, 100V, 0.5% +/-Tol, -100,100ppm/Cel, 0202, | Synchronous DRAM Module, 4MX64, 6ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 8MX64, 6ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 8MX64, 5.4ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 8MX64, 5.4ns, CMOS, LEAD FREE, SODIMM-144 | Synchronous DRAM Module, 8MX64, 5.4ns, CMOS, SODIMM-144 |
Reach Compliance Code | compliant | unknown | unknown | unknown | not_compliant | compliant | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Number of terminals | 144 | 2 | 144 | 144 | 144 | 144 | 144 |
Maximum operating temperature | 65 °C | 125 °C | 65 °C | 65 °C | 65 °C | 65 °C | 65 °C |
Package form | MICROELECTRONIC ASSEMBLY | SMT | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
technology | CMOS | THIN FILM | CMOS | CMOS | CMOS | CMOS | CMOS |
Is it Rohs certified? | incompatible | - | incompatible | incompatible | incompatible | conform to | - |
Maker | Micron Technology | - | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
Parts packaging code | MODULE | - | MODULE | MODULE | MODULE | MODULE | MODULE |
package instruction | DIMM, | - | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, |
Contacts | 144 | - | 144 | 144 | 144 | 144 | 144 |
Is Samacsys | N | - | N | N | N | N | N |
access mode | SINGLE BANK PAGE BURST | - | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST |
Maximum access time | 5.4 ns | - | 6 ns | 6 ns | 5.4 ns | 5.4 ns | 5.4 ns |
Other features | AUTO/SELF REFRESH | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 code | R-XDMA-N144 | - | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 |
JESD-609 code | e0 | - | e0 | e0 | e0 | e4 | - |
memory density | 1073741824 bit | - | 268435456 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE | - | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
memory width | 64 | - | 64 | 64 | 64 | 64 | 64 |
Number of functions | 1 | - | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | - | 1 | 1 | 1 | 1 | 1 |
word count | 16777216 words | - | 4194304 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
character code | 16000000 | - | 4000000 | 8000000 | 8000000 | 8000000 | 8000000 |
Operating mode | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
organize | 16MX64 | - | 4MX64 | 8MX64 | 8MX64 | 8MX64 | 8MX64 |
Package body material | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | DIMM | - | DIMM | DIMM | DIMM | DIMM | DIMM |
Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Peak Reflow Temperature (Celsius) | 235 | - | 235 | 235 | 235 | 260 | - |
Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
self refresh | YES | - | YES | YES | YES | YES | YES |
Maximum supply voltage (Vsup) | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | - | NO | NO | NO | NO | NO |
Temperature level | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Gold (Au) | - |
Terminal form | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal location | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 30 | - | 30 | 30 | 30 | 30 | - |
Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 |