MC14556BCPD datasheet, PDF - EEWORLD Datasheet

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MC14556BCPD: DescriptionIC,DECODER/DEMUX,2-TO-4-LINE,CMOS,DIP,16PIN,PLASTIC; Categorylogic; File Size623KB，9 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC14556BCPD Overview

IC,DECODER/DEMUX,2-TO-4-LINE,CMOS,DIP,16PIN,PLASTIC

MC14556BCPD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Is Samacsys	N
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
Logic integrated circuit type	OTHER DECODER/DRIVER
Number of functions	2
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

MC14556BCPD Related Products

	MC14556BCPD	MC14555BCPD	MC14555BCPDS	MC14555BCLD	MC14555BCLDS	PTN1206K2701JSTS
Description	IC,DECODER/DEMUX,2-TO-4-LINE,CMOS,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,2-TO-4-LINE,CMOS,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,2-TO-4-LINE,CMOS,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,2-TO-4-LINE,CMOS,DIP,16PIN,CERAMIC	IC,DECODER/DEMUX,2-TO-4-LINE,CMOS,DIP,16PIN,CERAMIC	Fixed Resistor, Thin Film, 0.4W, 2700ohm, 200V, 5% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	conform to
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	CHIP
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	compliant
Number of terminals	16	16	16	16	16	2
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	155 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-55 °C
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	SMT
surface mount	NO	NO	NO	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	THIN FILM
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Matte Tin (Sn) - with Nickel (Ni) barrier
Maker	NXP	NXP	NXP	NXP	NXP	-
Is Samacsys	N	N	N	N	N	-
JESD-30 code	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16	-
JESD-609 code	e0	e0	e0	e0	e0	-
Logic integrated circuit type	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	-
Number of functions	2	2	2	2	2	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	-
encapsulated code	DIP	DIP	DIP	DIP	DIP	-
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	-
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	-
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	-
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	-
Base Number Matches	1	1	1	1	1	-

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