Standard SRAM, 256KX16, 12ns, CMOS, PBGA48, 8 X 10 MM, MINI, BGA-48
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Integrated Silicon Solution ( ISSI ) |
| Parts packaging code | BGA |
| package instruction | LFBGA, BGA48,6X8,30 |
| Contacts | 48 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.2.A |
| Is Samacsys | N |
| Maximum access time | 12 ns |
| I/O type | COMMON |
| JESD-30 code | R-PBGA-B48 |
| JESD-609 code | e0 |
| length | 10 mm |
| memory density | 4194304 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 16 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 48 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX16 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFBGA |
| Encapsulate equivalent code | BGA48,6X8,30 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.35 mm |
| Maximum standby current | 0.01 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.09 mA |
| Maximum supply voltage (Vsup) | 3.63 V |
| Minimum supply voltage (Vsup) | 2.97 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | BALL |
| Terminal pitch | 0.75 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 8 mm |
| Base Number Matches | 1 |
| IS61LV25616AL-12B | IS61LV25616AL-10LQ | IS61LV25616AL-12KI | IS61LV25616AL-8BI | IS61LV25616AL-8K | IS61LV25616AL-8TI | IS61LV25616AL-12LQ | |
|---|---|---|---|---|---|---|---|
| Description | Standard SRAM, 256KX16, 12ns, CMOS, PBGA48, 8 X 10 MM, MINI, BGA-48 | Standard SRAM, 256KX16, 10ns, CMOS, PQFP44, LQFP-44 | Standard SRAM, 256KX16, 12ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 | Standard SRAM, 256KX16, 8ns, CMOS, PBGA48, 8 X 10 MM, MINI, BGA-48 | Standard SRAM, 256KX16, 8ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 | 256KX16 STANDARD SRAM, 8ns, PDSO44, TSOP2-44 | Standard SRAM, 256KX16, 12ns, CMOS, PQFP44, LQFP-44 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
| Parts packaging code | BGA | QFP | SOJ | BGA | SOJ | TSOP2 | QFP |
| package instruction | LFBGA, BGA48,6X8,30 | LQFP-44 | SOJ, SOJ44,.44 | LFBGA, BGA48,6X8,30 | SOJ, SOJ44,.44 | TSOP2-44 | LQFP-44 |
| Contacts | 48 | 44 | 44 | 48 | 44 | 44 | 44 |
| Reach Compliance Code | compliant | unknown | compliant | compliant | compliant | compliant | unknown |
| ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| Maximum access time | 12 ns | 10 ns | 12 ns | 8 ns | 8 ns | 8 ns | 12 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PBGA-B48 | S-PQFP-G44 | R-PDSO-J44 | R-PBGA-B48 | R-PDSO-J44 | R-PDSO-G44 | S-PQFP-G44 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 10 mm | 10 mm | 28.58 mm | 10 mm | 28.58 mm | 18.41 mm | 10 mm |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 48 | 44 | 44 | 48 | 44 | 44 | 44 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C |
| organize | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LFBGA | LQFP | SOJ | LFBGA | SOJ | TSOP2 | LQFP |
| Encapsulate equivalent code | BGA48,6X8,30 | QFP44,.47SQ,32 | SOJ44,.44 | BGA48,6X8,30 | SOJ44,.44 | TSOP44,.46,32 | QFP44,.47SQ,32 |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE | SMALL OUTLINE | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.35 mm | 1.6 mm | 3.76 mm | 1.35 mm | 3.76 mm | 1.2 mm | 1.6 mm |
| Maximum standby current | 0.01 A | 0.01 A | 0.015 A | 0.025 A | 0.02 A | 0.025 A | 0.015 A |
| Minimum standby current | 2 V | 2 V | 2 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
| Maximum slew rate | 0.09 mA | 0.1 mA | 0.1 mA | 0.11 mA | 0.1 mA | 0.11 mA | 0.09 mA |
| Maximum supply voltage (Vsup) | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V |
| Minimum supply voltage (Vsup) | 2.97 V | 3.135 V | 2.97 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | BALL | GULL WING | J BEND | BALL | J BEND | GULL WING | GULL WING |
| Terminal pitch | 0.75 mm | 0.8 mm | 1.27 mm | 0.75 mm | 1.27 mm | 0.8 mm | 0.8 mm |
| Terminal location | BOTTOM | QUAD | DUAL | BOTTOM | DUAL | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 8 mm | 10 mm | 10.16 mm | 8 mm | 10.16 mm | 10.16 mm | 10 mm |
| Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | - | 3 |
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