|
CD74HCT14M96 |
CD74HC14PWR |
CD74HCT14PWR |
CD74HCT4052M96 |
Description |
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|
|
|
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Parts packaging code |
SOIC |
TSSOP |
TSSOP |
SOIC |
package instruction |
SOP, SOP14,.25 |
TSSOP-14 |
TSSOP-14 |
GREEN, PLASTIC, SOIC-16 |
Contacts |
14 |
14 |
14 |
16 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Factory Lead Time |
6 weeks |
6 weeks |
6 weeks |
6 weeks |
JESD-30 code |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G16 |
JESD-609 code |
e4 |
e3 |
e4 |
e4 |
length |
8.65 mm |
5 mm |
5 mm |
9.9 mm |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
Number of functions |
6 |
6 |
6 |
1 |
Number of terminals |
14 |
14 |
14 |
16 |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
TSSOP |
TSSOP |
SOP |
Encapsulate equivalent code |
SOP14,.25 |
TSSOP14,.25 |
TSSOP14,.25 |
SOP16,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
power supply |
5 V |
2/6 V |
5 V |
5,GND/-5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.75 mm |
1.2 mm |
1.2 mm |
1.58 mm |
Maximum supply voltage (Vsup) |
5.5 V |
6 V |
5.5 V |
5 V |
Minimum supply voltage (Vsup) |
4.5 V |
2 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
4.5 V |
5 V |
4.5 V |
surface mount |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Matte Tin (Sn) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
1.27 mm |
0.65 mm |
0.65 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
3.9 mm |
4.4 mm |
4.4 mm |
3.91 mm |
series |
HCT |
HC |
HCT |
- |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
- |
Logic integrated circuit type |
INVERTER |
INVERTER |
INVERTER |
- |
MaximumI(ol) |
0.0052 A |
0.0052 A |
0.0052 A |
- |
Number of entries |
1 |
1 |
1 |
- |
method of packing |
TR |
TR |
TR |
- |
Maximum supply current (ICC) |
0.02 mA |
0.04 mA |
0.04 mA |
- |
Prop。Delay @ Nom-Sup |
57 ns |
41 ns |
57 ns |
- |
propagation delay (tpd) |
57 ns |
205 ns |
57 ns |
- |
Schmitt trigger |
YES |
YES |
YES |
- |