此商品编号的参数规格是： MLF2012C220KT000/0805
22uH ±10%
Inductors for Standard Circuits
Multilayer/STD • magnetic shielded
MLF series
Type:
MLF1005L
MLF1608
MLF2012
1005[0402 inch]*
1608[0603 inch]
2012[0805 inch]
* Dimensions Code JIS[EIA]
Issue date:
November 2011
• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(1/3)
Inductors for Standard Circuits
Multilayer/STD • Magnetic Shielded
MLF Series MLF2012
FEATURES
• High-reliability monolithic structure.
• Ferrite core and magnetic shielding enables the design of com-
pact circuits with high density mounting.
• Excellent solderability and high heat resistance permits either
flow or reflow soldering.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Digital cellular phone, car audio, TV, personal computers, or vari-
ous electronic appliances
SPECIFICATIONS
Operating temperature range
Storage temperature range
–40 to +85°C
–40 to +85°C(After mount)
Conformity to RoHS Directive
PRODUCT IDENTIFICATION
MLF 2012 A 1R0 K T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L×W
2012
2.0×1.25mm
(7)
(3) Type name
(4) Inductance
47N
R15
1R0
100
47nH[0.047µH]
0.15µH
1µH
10µH
(5) Tolerance
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
K
M
±10%
±20%
(6) Packaging style
10s max.
250 to 260˚C
230˚C
Natural
cooling
T
Taping [reel]
(7) TDK internal code
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Product’s thickness
0.85mm
1.25mm
Quantity
4000 pieces/reel
2000 pieces/reel
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
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