NXP Semiconductors
Data Sheet: Technical Data
Document Number S9KEA64P64M20SF0
Rev. 5, 05/2016
KEA64 Sub-Family Data
Sheet
Supports the following:
S9KEAZN16AMLC(R),
S9KEAZN32AMLC(R),
S9KEAZN64AMLC(R),
S9KEAZN16AMLH(R),
S9KEAZN32AMLH(R), and
S9KEAZN64AMLH(R)
Key features
• Operating characteristics
– Voltage range: 2.7 to 5.5 V
– Flash write voltage range: 2.7 to 5.5 V
– Temperature range (ambient): -40 to 125°C
• Performance
– Up to 40 MHz ARM® Cortex-M0+ core and up to
20 MHz bus clock
– Single cycle 32-bit x 32-bit multiplier
– Single cycle I/O access port
• Memories and memory interfaces
– Up to 64 KB flash
– Up to 256 B EEPROM
– Up to 4 KB RAM
• Clocks
– Oscillator (OSC) - supports 32.768 kHz crystal or 4
MHz to 20 MHz crystal or ceramic resonator; choice
of low power or high gain oscillators
– Internal clock source (ICS) - internal FLL with
internal or external reference, 31.25 kHz pre-
trimmed internal reference for 40 MHz system and
core clock.
– Internal 1 kHz low-power oscillator (LPO)
S9KEA64P64M20SF0
• System peripherals
– Power management module (PMC) with three power
modes: Run, Wait, Stop
– Low-voltage detection (LVD) with reset or interrupt,
selectable trip points
– Watchdog with independent clock source (WDOG)
– Programmable cyclic redundancy check module
(CRC)
– Serial wire debug interface (SWD)
– Bit manipulation engine (BME)
• Security and integrity modules
– 64-bit unique identification (ID) number per chip
• Human-machine interface
– Up to 57 general-purpose input/output (GPIO)
– Two up to 8-bit keyboard interrupt modules (KBI)
– External interrupt (IRQ)
• Analog modules
– One up to 16-channel 12-bit SAR ADC, operation in
Stop mode, optional hardware trigger (ADC)
– Two analog comparators containing a 6-bit DAC
and programmable reference input (ACMP)
• Timers
– One 6-channel FlexTimer/PWM (FTM)
– Two 2-channel FlexTimer/PWM (FTM)
– One 2-channel periodic interrupt timer (PIT)
– One real-time clock (RTC)
• Communication interfaces
– Two SPI modules (SPI)
– Up to three UART modules (UART)
– One I2C module (I2C)
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
© 2014–2016 NXP B.V.
• Package options
– 64-pin LQFP
– 32-pin LQFP
KEA64 Sub-Family Data Sheet, Rev. 5, 05/2016
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NXP Semiconductors
Table of Contents
1 Ordering parts.......................................................................................4
1.1 Determining valid orderable parts............................................... 4
2 Part identification................................................................................. 4
2.1 Description...................................................................................4
2.2 Format.......................................................................................... 4
2.3 Fields............................................................................................4
2.4 Example....................................................................................... 5
3 Ratings..................................................................................................5
3.1 Thermal handling ratings............................................................. 5
3.2 Moisture handling ratings............................................................ 5
3.3 ESD handling ratings................................................................... 6
3.4 Voltage and current operating ratings..........................................6
4 General................................................................................................. 7
4.1 Nonswitching electrical specifications........................................ 7
4.1.1
4.1.2
4.1.3
DC characteristics.......................................................... 7
Supply current characteristics........................................ 13
EMC performance..........................................................15
4.2.2
FTM module timing....................................................... 16
4.3 Thermal specifications................................................................. 17
4.3.1
Thermal characteristics.................................................. 17
5 Peripheral operating requirements and behaviors................................ 18
5.1 Core modules............................................................................... 18
5.1.1
SWD electricals .............................................................18
5.2 External oscillator (OSC) and ICS characteristics.......................19
5.3 NVM specifications..................................................................... 21
5.4 Analog..........................................................................................23
5.4.1
5.4.2
ADC characteristics....................................................... 23
Analog comparator (ACMP) electricals.........................25
5.5 Communication interfaces........................................................... 26
5.5.1
SPI switching specifications.......................................... 26
6 Dimensions...........................................................................................29
6.1 Obtaining package dimensions.................................................... 29
7 Pinout................................................................................................... 29
7.1 Signal multiplexing and pin assignments.................................... 29
8 Revision History...................................................................................30
4.2 Switching specifications.............................................................. 15
4.2.1
Control timing................................................................ 15
KEA64 Sub-Family Data Sheet, Rev. 5, 05/2016
NXP Semiconductors
3
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
nxp.com
and perform a part number search for the
following device numbers: KEAZN64.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q B KEA A C FFF M T PP N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
B
KEA
A
Description
Qualification status
Memory type
Kinetis Auto family
Key attribute
Values
• S = Automotive qualified
• P = Prequalification
• 9 = Flash
• KEA
• Z = M0+ core
• F = M4 W/ DSP & FPU
• C= M4 W/ AP + FPU
• N = CAN not available
• (Blank) = CAN available
C
CAN availability
Table continues on the next page...
KEA64 Sub-Family Data Sheet, Rev. 5, 05/2016
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NXP Semiconductors
Ratings
Field
FFF
Description
Program flash memory size
• 16 = 16 KB
• 32 = 32 KB
• 64 = 64 KB
• A = 1
st
Fab version
• B = Revision after 1
st
version
• C = –40 to 85
• V= –40 to 105
• M = –40 to 125
• LC = 32 LQFP (7 mm x 7 mm)
• LH = 64 LQFP (10 mm x 10 mm)
• R = Tape and reel
• (Blank) = Trays
Values
M
T
Maskset revision
Temperature range (°C)
PP
N
Package identifier
Packaging type
2.4 Example
This is an example part number:
S9KEAZN64AMLH
3 Ratings
3.1 Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
3.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
3
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
KEA64 Sub-Family Data Sheet, Rev. 5, 05/2016
NXP Semiconductors
5
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