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74AHC08BQ,115

Categorylogic    logic   
File Size606KB,14 Pages
ManufacturerNexperia
Websitehttps://www.nexperia.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74AHC08BQ,115 Parametric

Parameter NameAttribute value
Brand NameNexperia
Is it Rohs certified?conform to
MakerNexperia
Parts packaging codeQFN
package instructionHVQCCN,
Contacts14
Manufacturer packaging codeSOT762-1
Reach Compliance Codecompliant
Factory Lead Time8 weeks
Samacsys Description74AHC(T)08 - Quad 2-input AND gate@en-us
seriesAHC/VHC/H/U/V
JESD-30 codeR-PQCC-N14
JESD-609 codee4
length3 mm
Logic integrated circuit typeAND GATE
Humidity sensitivity level1
Number of functions4
Number of entries2
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHVQCCN
Package shapeRECTANGULAR
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)260
propagation delay (tpd)15.5 ns
Certification statusNot Qualified
Maximum seat height1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width2.5 mm
Base Number Matches1
74AHC08; 74AHCT08
Quad 2-input AND gate
Rev. 03 — 14 November 2007
Product data sheet
1. General description
The 74AHC08; 74AHCT08 is a high-speed Si-gate CMOS device and is pin compatible
with Low-power Schottky TTL (LSTTL). They are specified in compliance with JEDEC
standard JESD7-A.
The 74AHC08; 74AHCT08 provides the quad 2-input AND function.
2. Features
s
s
s
s
s
s
Balanced propagation delays
All inputs have a Schmitt-trigger action
Inputs accepts voltages higher than V
CC
For 74AHC08 only: operates with CMOS input levels
For 74AHCT08 only: operates with TTL input levels
ESD protection:
x
HBM JESD22-A114E exceeds 2000 V
x
MM JESD22-A115-A exceeds 200 V
x
CDM JESD22-C101C exceeds 1000 V
s
Multiple package options
s
Specified from
−40 °C
to +85
°C
and from
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74AHC08D
74AHCT08D
74AHC08PW
74AHCT08PW
74AHC08BQ
74AHCT08BQ
−40 °C
to +125
°C
−40 °C
to +125
°C
TSSOP14
−40 °C
to +125
°C
Name
SO14
Description
plastic small outline package; 14 leads;
body width 3.9 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
Version
SOT108-1
SOT402-1
SOT762-1
Type number
DHVQFN14 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5
×
3
×
0.85 mm

74AHC08BQ,115 Related Products

74AHC08BQ,115 74AHC08PW,118 74AHCT08BQ,115 74AHCT08PW,118 74AHCT08D,118
Description IC GATE AND 4CH 2-INP 14TSSOP IC GATE AND 4CH 2-INP 14DHVQFN IC GATE AND 4CH 2-INP 14TSSOP Logic Type: AND Gate Additional Features:-
Brand Name Nexperia Nexperia Nexperia Nexperia Nexperia
Maker Nexperia Nexperia Nexperia Nexperia Nexperia
Parts packaging code QFN TSSOP QFN TSSOP SOIC
package instruction HVQCCN, TSSOP, HVQCCN, TSSOP, SOP,
Contacts 14 14 14 14 14
Manufacturer packaging code SOT762-1 SOT402-1 SOT762-1 SOT402-1 SOT108-1
Reach Compliance Code compliant compliant compliant compliant compliant
Samacsys Description 74AHC(T)08 - Quad 2-input AND gate@en-us 74AHC(T)08 - Quad 2-input AND gate@en-us 74AHC(T)08 - Quad 2-input AND gate@en-us 74AHC(T)08 - Quad 2-input AND gate@en-us 74AHC(T)08 - Quad 2-input AND gate@en-us
series AHC/VHC/H/U/V AHC/VHC/H/U/V AHCT/VHCT/VT AHCT/VHCT/VT AHCT/VHCT/VT
JESD-30 code R-PQCC-N14 R-PDSO-G14 R-PQCC-N14 R-PDSO-G14 R-PDSO-G14
JESD-609 code e4 e4 e4 e4 e4
length 3 mm 5 mm 3 mm 5 mm 8.65 mm
Logic integrated circuit type AND GATE AND GATE AND GATE AND GATE AND GATE
Humidity sensitivity level 1 1 1 1 1
Number of functions 4 4 4 4 4
Number of entries 2 2 2 2 2
Number of terminals 14 14 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVQCCN TSSOP HVQCCN TSSOP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260 260 260 260
propagation delay (tpd) 15.5 ns 15.5 ns 10 ns 10 ns 10 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1 mm 1.1 mm 1 mm 1.1 mm 1.75 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2 V 2 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form NO LEAD GULL WING NO LEAD GULL WING GULL WING
Terminal pitch 0.5 mm 0.65 mm 0.5 mm 0.65 mm 1.27 mm
Terminal location QUAD DUAL QUAD DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30 30
width 2.5 mm 4.4 mm 2.5 mm 4.4 mm 3.9 mm
Factory Lead Time 8 weeks 4 weeks - - 4 weeks

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